MediaTek Dimensity smart phone SoC taped out in TSMC's 3nm Process

Date: 08/09/2023
With volume manufacturing anticipated for next year, MediaTek has successfully produced its first chip using TSMC's cutting-edge 3nm technology. The chip is a version of MediaTek's flagship Dimensity system-on-chip (SoC). With both companies utilizing their strengths in chip design and manufacturing to jointly develop flagship SoCs with high performance and low power features, they have reached a significant turning point in their long-standing strategic partnership. These SoCs to power a wide range of end devices around the world.

The 3nm process technology from TSMC offers improved performance, power, and yield along with full support for both mobile and high performance computer applications. TSMC's 3nm technology delivers either an 18% speed boost at the same power or 32% power reduction at the same speed, and a approximately 60% increase in logic density when compared to its little older N5 process.

“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“