Micron to build new semiconductor chip assembly and test facility in Gujarat, India

Micron announces its plan to build new semiconductor chip assembly and test facility in Gujarat, India. Both DRAM and NAND wafers to get assembled/packaged here. Micron’s new facility to focus on transforming wafers into ball grid array (BGA) integrated circuit packages, memory modules and solid-state drives. Construction to begin in 2023 and to be operational by late 2024. Micron to ramp capacity gradually over time in line with global demand trends. Micron expects Phase 2 of the project, which would include construction of a facility similar in scale to Phase 1, to start towards the second half of the decade. The new facility to address demand from domestic and international markets. This facility to create up to 5,000 new direct Micron jobs and 15,000 community jobs over the next several years. Under the government's “Modified Assembly, Testing, Marking and Packaging (ATMP) Scheme,” Micron will receive 50% fiscal support for the total project cost from the Indian central government and incentives representing 20% of the total project cost from the state of Gujarat. The combined investment by Micron and the two government entities over the course of both phases will be up to $2.75 billion, where Micron's investment is $825 Million. Government support will help fund the project and facilitate access to essential semiconductor infrastructure and resources to drive i...