Indium Corporation experts will present six technical sessions at SMTA International 2026, October 25–29, in Rosemont, Illinois, covering thermal interface materials, defect mitigation and lead-free assembly protocols.
On October 27, Adam Murling will present “Back to Basics: Mastering the First Step – Stencil Printing” from 10:30 a.m.-12:00 p.m. CDT, covering solder paste selection, stencil printing and factors that influence print quality and defects. Hongwen Zhang’s session, “Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and Temperature Cycling Test Reliability,” will examine SAC305, SAC-Bi, SAC-3Bi and SAC-In BGA ball alloys. Lee Hong Kim will present “Are Gaps Bad for Printing?” on how print gaps and board quality affect solder paste printing, drawing on more than 50,000 solder paste inspection measurements.
On October 28, Ronald C. Lasky will discuss implementing solder thermal interface materials in high-performance electronics, including materials for micro-bump wafer bumping and Chip-on-Wafer processes, mid-temperature solder pastes, and advanced TIMs for high-performance computing chips. Lasky will also present “Restriction of Hazardous Substances (RoHS): Twenty Years Later,” examining lead-free manufacturing advances and challenges. Thuy Nguyen will present research on how surface finishes affect void formation in mixed-alloy solder paste systems for bottom-terminated components.
The presentations will take place during SMTA International 2026 in Rosemont, Illinois. Indium Corporation says information about its advanced packaging, TIMs and PCB assembly solutions is available at indium.com.
