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Rambus and ChipAgents Partner on Agentic AI for Chip Design

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Rambus Inc. and ChipAgents have announced a strategic agreement to accelerate chip design with agentic AI, with Rambus adopting the ChipAgents platform companywide.

Rambus will deploy the platform across its chip and silicon IP design and verification workflows. The companies will combine Rambus’ semiconductor expertise and silicon IP with ChipAgents’ agentic AI platform and workflows to improve design speed and Quality of Results (QoR) across customers’ preferred design environments.

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Rambus and ChipAgents Partner on Agentic AI for Chip Design

Rambus has also become a strategic investor in ChipAgents. Luc Seraphin, president and chief executive officer of Rambus, said AI is driving demand for more advanced chips and increasingly complex systems while transforming how those chips are designed. He said the platform could accelerate chip and IP development and enhance engineering productivity.

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William Wang, founder and chief executive officer of ChipAgents, said the collaboration aims to move beyond automating individual tasks toward a more holistic, AI-native approach to chip design, while preserving engineering teams’ choice of tools and technologies.

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EEHerald News Desk

Editor, Electronics Engineering Herald


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