SEMI has projected global silicon wafer shipments will increase 11.8% in 2026 to 14,420 million square inches (MSI), with successive record highs expected from 2027 through 2029.
Strong AI-related demand is leading shipment growth in 2026, supporting advanced epitaxial wafers for leading-edge logic and polished wafers for memory applications. Memory demand extends beyond high-bandwidth memory (HBM) to server DRAM and enterprise NAND flash. Recovering mature-node utilization and easing customer inventory adjustments are also supporting growth this year. SEMI expects continued expansion of AI infrastructure to underpin demand through 2029.
Silicon wafers are the fundamental building material for most semiconductors. These highly engineered thin disks, produced in diameters of up to 300 mm, serve as the substrate material on which most semiconductor devices, or chips, are fabricated.
The forecast covers polished and epitaxial silicon wafers shipped by wafer manufacturers to end users and excludes non-polished or reclaimed wafers. SEMI developed the annual forecast using input from members of its Silicon Manufacturers Group; the forecast reflects industry input and is not an official forecast of the group or any individual member company.
