From Cleanroom to Commercial Line: India's OSAT Story at Semicon India 2026

While the Dholera fab still dominates headlines, it was India's assembly, testing, marking and packaging industry  the unglamorous back end of chipmaking  that delivered the most concrete milestones of the week. Two ATMP facilities went commercial live on the inauguration stage itself.

OSAT: Outsourced Semiconductor Assembly and Test  and its close cousin ATMP (Assembly, Testing, Marking and Packaging) refer to the stage after a wafer leaves the fab: dicing it into individual chips, packaging them for protection and connectivity, and testing them before they reach a customer. It is widely seen as the more accessible entry point into semiconductor manufacturing for a country without a long history of front-end fabrication, and SEMICON India 2026 made clear that India is leaning into that strategy deliberately.
Two facilities go live, virtually
Prime Minister Narendra Modi virtually inaugurated commercial production lines at two facilities during the event's opening day: CDIL Semiconductor in Mohali, Punjab, for discrete devices, and Suchi Semicon in Surat, Gujarat, for packaging. That took the number of operational commercial semiconductor units among the twelve projects approved under Semicon 1.0 to five, joining Micron, Kaynes and CG Semi. CDIL also announced an association with Japan's Shindengen Electric Manufacturing Company f...