Amkor Technology expands Arizona advanced packaging and test campus investment to $12 billion

Amkor Technology, a major provider of outsourced semiconductor packaging and testing services, has unveiled phase 2 of its advanced packaging and test campus in Arizona. Customer demand has already exceeded the 33,000 square meters of cleanroom space originally planned for phase 1, prompting the phase 2 expansion, which will add another 60,000 square meters and bring the total campus size to roughly 93,000 square meters of cleanroom capacity. This expansion pushes the project's overall planned investment up to approximately $12 billion.

Built from the start as a project meant to unfold in multiple phases, Amkor's Arizona campus covers wafer bumping, probing, assembly, and testing, and is being developed to meet long-term U.S. demand for advanced semiconductor packaging and testing. Phase 2 scales up manufacturing capacity, and combined with phase 1, the campus is expected to support a workforce of over 3,500 employees based in Arizona.

Kevin Engel, Amkor's president and CEO, said this next phase reflects the trust customers have placed in the company, the growing importance of advanced packaging to the future of semiconductor innovation, and the strategic value of the Arizona campus. He noted that as chip designs grow more complex, customers need a reliable partner able to deliver at scale with the quality, technological edge, and operational rigor their most advanced products demand, and that having that capacity based in the U.S. is essential.

Amkor's Arizona campus stands as the first high-volume OSAT production site for advanced packaging in the United States, giving customers a complete domestic turnkey manufacturing option. Construction on phase 2 is expected to start in late 2027 and finish by the end of 2029. The 170-acre Arizona site leaves room for additional future expansion as customer demand continues to grow.