PM Modi Virtually Lays Foundation for ASIP OSAT Semiconductor Facility in Visakhapatnam Under India Semiconductor Mission

Prime Minister Narendra Modi virtually laid the foundation stone and unveiled the plaque for the ASIP Technologies semiconductor manufacturing facility at Tarluvada in Visakhapatnam. Andhra Pradesh Chief Minister N. Chandrababu Naidu joined the ceremony virtually.

The event marked the groundbreaking of the Advanced System in Package Technologies (ASIP) Outsourced Semiconductor Assembly and Test (OSAT) facility. The Rs 2,500 crore project is Andhra Pradesh’s and South India’s first semiconductor manufacturing facility approved under the India Semiconductor Mission (ISM 1.0).

ASIP is a semiconductor packaging and testing company focused on establishing OSAT capabilities in India. It is backed by global industry expertise, advanced manufacturing technologies, and strategic international partnerships. The company aims to serve semiconductor companies across North America, Asia, and other markets through packaging and testing solutions, talent development, technological innovation, and industrial growth.

The 30-acre facility is being set up with an initial investment of over Rs 460 crore in partnership with APACT Co. of South Korea as the technology partner. It will have an annual production capacity of 96 million chips. The facility will serve sectors including arti...