Amkor, NVIDIA Form Multi-Year Partnership to Expand Advanced Packaging for AI Infrastructure

Amkor Technology, has announced a multi-year strategic partnership with NVIDIA aimed at developing advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor's advanced packaging capacity in the U.S.

Advanced packaging plays a key role in enabling the performance, energy efficiency, and system-level integration required for AI infrastructure. As part of the partnership, NVIDIA and Amkor will align their long-term technology roadmaps to advance areas including high-density interconnects and next-generation heterogeneous integration.

Amkor has already supplied advanced packaging solutions supporting the performance and reliability of NVIDIA platforms across a broad range of products, including data center processors, networking chipsets, and next-generation accelerated computing systems. This expanded collaboration is intended to bring new packaging technologies to market at scale as demand for AI infrastructure continues to grow.

The partnership also reflects a shared commitment to expanding full turnkey advanced packaging and test capabilities within the United States, strengthening domestic semiconductor manufacturing and supply-chain resilience for AI infrastructure. NVIDIA's capacity agreement supports Amkor's...