Apple Announces New Multiyear Agreement with Broadcom for U.S. Chip Production Exceeding $30 Billion

Apple announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products. The agreement, expected to exceed $30 billion, will lead to the production of more than 15 billion U.S.-made chips and support hundreds of American jobs.

The agreement advances Apple’s efforts, in coordination with the administration and U.S. businesses, to create an end-to-end silicon supply chain in America. Broadcom participates in Apple’s American Manufacturing Program (AMP), launched last year. This new agreement represents Apple’s largest AMP commitment to date.

Under the agreement, Broadcom will expand and modernize its manufacturing facilities in Fort Collins, Colorado, through a $1.5 billion capital expenditure investment. The facility will produce advanced radio frequency components, including FBAR filters, and advanced wireless connectivity technologies.

“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation,” said Tim Cook, Apple’s CEO. “The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to d...