Asahi Kasei Opens New SUNFORT Slitting Facility for Semiconductor Packaging in Taiwan

Asahi Kasei has completed construction of a new slitting facility for SUNFORT dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, on July 3, with commercial operations scheduled to begin this month.

The company has conducted slitting operations for SUNFORT DFR at the Tainan site since 1997. Demand for advanced semiconductor packaging has grown in recent years, driven by AI and higher data processing requirements. This has led to stricter standards for quality and supply reliability of DFR used in semiconductor packaging.

Taiwan serves as a key location due to the concentration of semiconductor packaging companies there, supporting the need for rapid and reliable local supply.

Slitting involves cutting master rolls of film into narrower widths based on individual customer specifications and is a critical step affecting product quality and supply reliability. The new facility includes advanced machines and rigorous cleanroom standards to support productivity and supply. The project represents an investment of approximately ¥2 billion (approximately $12 million or €11 million) and is expected to expand capacity by 40%, with potential to double current output.

SUNFORT DFR provides ultra-high reso...