Keysight and WIN Semiconductors Launch Joint GaN MMIC Design Workflow for First-Pass Tapeout

Keysight Technologies, and WIN Semiconductors Corp. have announced a joint MMIC design workflow that connects on-chip multi-domain simulation, 3D layout with verifications, and off-chip MMIC evaluation board design within a single environment.

The workflow is intended to enable GaN MMIC design houses to achieve first-pass tapeout success for components used in 5G base stations, Wi-Fi access points, satellite payloads, and defense radar systems. It automates the full set of simulation, optimization, and verification steps required to sign off on an MMIC design before submission to the foundry, reducing the risk of failed tapeouts that can result in weeks lost to respin.

The solution addresses the requirement that MMIC customers typically do not commit to purchase until performance is measured on a physical evaluation board that includes the MMIC, packaging, PCB, and test connectors. The workflow allows engineers to design and optimize on-chip and off-chip components together to meet specifications as verified with test equipment.

WIN Semiconductors’ latest NP 120P GaN Process Design Kit provides MMIC designers with process models and layout rules. These are integrated into Keysight Advanced Design System (ADS) and RF Circuit Simulation Professional to automate the workflow.

Richard Kuo, Director of Design Service at WIN Semiconductors, stated...