SoC Chips and Modules to simplify your IoT hardware/board design

Internet of Things (IoT) drives the growth of semiconductor industry in the next years. Baseband processors, Batteries, Cameras, Memory chips, Touch sensors, Wi-Fi, etc., - all have undergone broad technological advancements at a brisk pace. So, naturally, the chip makers have realized to design smaller, cheaper but more powerful components. IoT is still highly fragmented with a lot of partial solutions and thus developing successful products depends mainly on the competence to integrate and apply these solutions. For example, it’s crucial to combine the functionalities of sensors, actuators and computing power – such as security, connectivity and microprocessors. Sometimes a single-chip solution is not always possible or preferred. Many semiconductor companies have released highly integrated devices (modules) to support new IoT products. For example, new low-power System-on-Chip (SoC) integrated module support both wireless protocols, and external sensing and communication technologies. The inherent complexity of RF design, wireless connectivity and qualifying compliances are easily achieved by using these integrated modules. Modules drive “Rapid time-to-market, Wide range of products” while ICs move with “Less expensive, Custom Design products” IC or module based wireless solutions can be adopted after carefully evaluating various application needs as well as cons...