40nm eNVM low-power process tech jointly by GLOBALFOUNDRIES and NXP

Date: 28/03/2015
GLOBALFOUNDRIES and NXP Semiconductor jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform.

GLOBALFOUNDRIES says it is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology. Volume production is expected in 2016 at its Singapore facility.

This on-chip eNVM technology is used in making id chips, NFC, healthcare, and microcontroller chips.

Author: Srinivasa Reddy N
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