Coventor hosts a roundtable on FinFET, 3-D IC fabrication and more

Virtual semiconductor fabrication software vendor Coventor is hosting an expert roundtable discussion at the 2013 edition of IEEE International Electron Devices Meeting (IEDM) going to be held on December 7-11, 2013 in Washington, DC U.S. The topics to be discussed includes FinFET, 3-D ICs, multiple patterning, advance modeling and simulation techniques, process variation challenges, and accelerating yield ramps. Participants in the roundtable will include: Dr. Brian Green, Senor Engineer/FEOL Architect: IBM Mark Fisher, Senior Research Engineer: Micron Dr. Andy Wei, Principle Member of Technical Staff – 10nm: GLOBALFOUNDRIES Jaouen Herve, Director, Modeling & Simulation: ST Microelectronics Sean Lian, Director/Technology Lead: Samsung Laith Altimime, Director CMOS Technology & Design: IMEC David Fried, CTO-Semiconductor: Coventor, Inc. Event details: Tuesday, December 10 Churchill Embassy Row Hotel: Kalorama Ballroom...