India ESDM: IPCA event on India electronics manufacturing

IPC India to host Electronics System Design and Manufacturing (ESDM) specific event called IPC APEX India on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India. IPC APEX India will offer professional development workshops on 26–29 August, as well as a technical conference and exhibition on 27–29 August. The list of sessions: On 27 Aug: 1. "Counterfeiting and Semiconductor Value Chain Economics," by Rory King of IHS Inc. 2. "Electronics Engineering Management — Counterfeit Electronics Components," by Seema Sabikhi of Barco Electronic Systems (P) Ltd. Focusing on advancements in design, Chandrakanth Gajawada of Sienna ECAD Technologies will discuss 3. "Design for Assembly (DFA) Analysis," by Chandrakanth Gajawada of Sienna ECAD Technologies 4. "Design and Development of Cost-Effective General Purpose FPGA Board." by Mr. Giridharan and Ugra Mohan Roy, SAP AG 5. "TMV PoP (0.4/0.4mm Pitch) Assembly and Design Challenges," by Ranilo Aranda of Flextronics Manufacturing (Zhuhai) Co. Ltd. On 28 August: 1. "Developments in Advanced Packaging," by TechSearch International's Dr. Timothy G. Lenihan 2. "SMT Reflow Profile Optimization in the Challenging Lead-Free World," by Liyakathali K. of Indium Corporation. 3. "Alcohol-Passivated Nano-Silver Paste for Electronic Assembly," by Wayne Ng of Nihon Superior Trading (S) Pte. 4. "Alternative Allo...