European group to work on developing power semiconductor using 300mm wafer

A total of 32 European partners from European industry and research including Infineon Technologies AG are collaborating in developing advanced production technologies for power semiconductors. The research project named “Enhanced Power Pilot Line” (EPPL) is aimed at further strengthening Europe as a high-technology industrial production site. Infineon said in its release "Europe is home to the first power semiconductor production sites manufacturing devices using 300-millimeter thin-wafer technology, i.e. on silicon wafers with a 300mm diameter which in addition are extremely thin: hardly thicker than a sheet of paper. With EPPL, Europe intends to further expand this production advantage." The partner organizations cover the entire industry and research value chain of 300 millimeter power semiconductor production, comprising material research with a focus on silicon, semiconductor development that includes 3D integration and packaging, and related developments in logistics and automation technologies. The project will run until mid 2016, with Infineon as the project lead, stated in the release. "A project volume of Euro 74 million and the commitment of 32 partner organizations strongly underline the importance of EPPL for the semiconductor industry in Europe,” says Sabine Herlitschka, Chief Technology and Innovation Officer of Infineon Technologies Austria. “Infineon ...