Littelfuse, has announced the launch of the Littelfuse/C&K TDB Series, an ultra-miniature, half-pitch surface-mount DIP switch family. The TDB Series features a 1.27 mm half-pitch footprint. It uses gold-plated bifurcated contacts and a top-tape sealed construction that supports automated surface-mount soldering and post-reflow aqueous cleaning.
Contact ratings are up to 50 V DC at 100 mA (steady state). The switches have a mechanical and electrical life of 1,000 cycles and a maximum contact resistance of 100 mΩ.
The series is available in five configurations:
- TDB02: 2 positions, body length 3.67 mm
- TDB04: 4 positions, body length 6.21 mm
- TDB06: 6 positions, body length 8.75 mm
- TDB08: 8 positions, body length 11.29 mm
- TDB10: 10 positions, body length 13.83 mm
The TDB Series is designed as a complementary solution to C&K’s TDA Series for applications requiring ultra-compact surface-mount DIP switches. It is supplied in tube or tape-and-reel packaging and is compatible with standard SMT processes.
Target applications include industrial control equipment, power supplies and inverter systems, security and fire alarm systems, building automation and smoke detection, and consumer IoT and smart home devices.
Jesus Santos, Global Product Manager at Littelfuse, stated: “When space is critical, and reliability is non-negotiable, the TDB Series delivers exactly what design engineers need. Its ultra-miniature footprint, gold-plated contacts, and washable sealing enable confident designs even in dense, demanding applications.”
The TDB DIP switches are available now. Samples can be requested through authorized Littelfuse distributors worldwide.
