ROHM has released three reference designs REF68005, REF68006, and REF68004 for three-phase inverter circuits incorporating its EcoSiC brand SiC molded modules HSDIP20, DOT-247, and TRCDRIVE pack. The designs are available on ROHM’s website.
Designers can use the provided data to develop drive circuit boards. When paired with ROHM's SiC modules, the reference designs reduce the time required for device evaluation. In high-power conversion circuits, SiC power devices improve efficiency and reliability but increase demands on peripheral circuit and thermal design. These reference designs support output power levels up to the 300 kW class, enabling broader adoption of SiC modules in automotive and industrial applications.
The three compatible SiC modules are available for purchase through online distributors including DigiKey and Farnell.
Reference design details:
REF68005: Approximately 5 kW output power; targets AC servo drive, motor drive, e-compressor; uses HSDIP20 (6 in 1) module; evaluation kit BST70T2P4K01-EVK-001.
REF68006: Approximately 10 kW output power; targets HVAC, PV, ESS, pump, xEV charger; uses DOT-247 (2 in 1 × 3) module; evaluation kit SCZ4009KTAHRC23-EVK-A09.
REF68004: Approximately 100 kW output power; targets xEV traction inverter;
uses TRCDRIVE pack (2 in 1 × 3) module; evaluation kit GD6112TRC3P-EVK-003.
All designs follow a three-phase full bridge topology and include tools such as quick start guide, user's guide, BOM, layout, and schematic.
Reference design boards or evaluation kits are available in limited quantities by contacting a ROHM sales representative or through the contact page on ROHM’s website.
Additional support includes downloads of design data from reference design pages, product information from SiC module pages, and access to the ROHM Solution Simulator for system-level verification starting from component selection. LTspice circuit models are available for HSDIP20 and DOT-247.
ROHM also provides other reference designs and application evaluation kits to reduce user design effort. Related news releases cover the development of HSDIP20, DOT-247, and TRCDRIVE pack modules.
