STMicroelectronics Starts High-Volume 300 mm Production of PIC100 Silicon Photonics Platform for 800G and 1.6T Optical Interconnects

STMicroelectronics has entered high-volume production of its PIC100 silicon photonics platform on 300 mm wafers. The platform supplies 800G and 1.6T transceivers to leading hyperscalers for optical interconnects in data centers and AI clusters. The company also disclosed its roadmap for the PIC100 TSV platform that adds through-silicon via integration.

According to LightCounting, the data center pluggable optics market reached $15.5 billion in 2025 and is projected to grow at a 17% CAGR through 2030, exceeding $34 billion. Co-packaged optics (CPO) is expected to contribute more than $9 billion by 2030, while the portion of transceivers using silicon photonics modulators rises from 43% in 2025 to 76% in 2030. MarketsandMarkets reports the overall silicon photonics market expanding at a 29.5% CAGR from 2025 to 2030, driven by AI and cloud computing bandwidth requirements. LightCounting notes that AI-driven scale-up networks are creating a new segment for optical interconnects, with 800G and 1.6T modules addressing the shift from electrical to optical connectivity as copper reaches reach and power limits.

The PIC100 platform delivers waveguide losses of 0.4 dB/cm in silicon and 0.5 dB/cm in silicon nitride, together with advanced modulator and photodiode performance and an innovative edge-coupling technology. These parameters support 200 Gbit/s per lane operation ...