Bourns Releases BTJ Series Thermal Jumper Chips for Heat Dissipation in Compact Electronics

Bourns, introduced the BTJ Series Thermal Jumper Chips, designed to provide thermal dissipation in a compact form factor.

The devices feature high thermal conductivity and insulating properties. They dissipate heat without conducting electricity, resulting in no impact on system operation.

Available in SMD packaging, the thermal jumper chips apply to mobile devices and electronic equipment, including power supplies, converters, RF amplifiers, and GaN amplifiers.

The design uses the insulating properties to fill space between heating elements and heat detection elements for heat detection. The chips reduce temperature rise of components.

The BTJ Series Thermal Jumper Chips are available now, RoHS compliant, and halogen free.