Teradyne Introduces UltraPHY 224G for High-Speed AI Data Center and Silicon Photonics Testing

Teradyne releases its new UltraPHY 224G for UltraFLEXplus, extending its portfolio beyond the UltraPHY 112G instrument, which is in production and adopted by several customers. Both solutions are designed for the UltraFLEXplus platform and utilize Teradyne’s IG-XL software.

Developed in collaboration with Multilane modules, UltraPHY 224G provides bench-quality signal generation and measurement for production testing, with test density and signal fidelity suited for next-generation semiconductor interfaces. It addresses emerging data rates in data center and silicon photonics (SiPh) markets, supporting chiplet-based architectures, advanced packaging, and known good die (KGD) workflows.

Roy Chorev, Vice President and General Manager of the Compute Test Division at Teradyne, stated, “With the introduction of Teradyne UltraPHY 224G, we are extending our portfolio to meet the most demanding next-generation PHY test requirements. Customers can be confident that their UltraPHY investments support both today’s and tomorrow’s chiplet-based architectures, advanced packaging, and KGD workflows.”

UltraPHY 112G is optimized for current high-speed standards, while UltraPHY 224G targets higher data rates. Both instruments can operate simultaneously in the same UltraFLEXplus platform to cover a range of high-speed interfaces.

UltraPH...