SK hynix Prepares for Mass Production with Enhanced AI Memory Bandwidth and Efficiency

SK hynix  announced the completion of HBM4 development, a next-generation high-bandwidth memory (HBM) product for ultra-high-performance AI applications, and has prepared for mass production, marking a global first. The company aims to supply HBM4 to meet customer timelines and maintain its competitive position in the AI memory market.

HBM4 achieves a doubled bandwidth compared to its predecessor through the adoption of 2,048 I/O terminals and improves power efficiency by over 40%. It offers a data processing speed exceeding 10Gbps, surpassing the JEDEC standard of 8Gbps. When applied, HBM4 is expected to enhance AI service performance by up to 69%, addressing data bottlenecks and reducing data center power costs.

The product utilizes the Advanced MR-MUF process for reliable chip stacking and heat dissipation, alongside the 1bnm process, the fifth generation of 10-nanometer technology, to minimize mass production risks. These advancements support stable production and address the growing demand for high-bandwidth, power-efficient memory driven by increasing AI data processing needs and data center power consumption.

HBM4 is positioned as a core product to overcome AI infrastructure limitations, enabling SK hynix to expand as a full-stack AI memory provider. ...