Mitsubishi Electric Unveils Compact DIPIPM Series for AI-Enhanced Inverter Systems in Consumer and Industrial Applications

Mitsubishi announced the development of its Compact DIPIPM series of power semiconductor modules, designed for consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The series includes the PSS30SF1F6 (30A/600V) and PSS50SF1F6 (50A/600V) models, with sample shipments starting September 22, 2025. 

The modules will be showcased at Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025 in Shanghai, China, from September 24 to 26. Utilizing reverse-conducting insulated-gate bipolar transistors (RC-IGBTs), the Compact DIPIPM series reduces the footprint to approximately 53% of the company’s conventional Mini DIPIPM Ver.7 series, enabling more compact inverter substrates. The modules maintain a 50A current rating through high-heat dissipation insulating sheet material, which suppresses temperature rise at the junction. A new interlock function for arm short-circuit protection, alongside the existing short-circuit protection using an external shunt resistor, simplifies inverter substrate design. The insulation distance from terminals to the heat sink matches that of conventional products, facilitating replacement.

The series expands the continuous operating temperature lower limit to -40°C, suppo...