Teledyne HiRel Introduces 128GB eMMC 5.1 Module for Embedded Systems

Teledyne HiRel Semiconductors has launched an industrial-grade embedded MultiMediaCard (eMMC) module with 128GB of eMMC 5.1-compliant storage in a 153-ball FBGA package. Designed for reliable, high-speed performance in harsh environments, the module operates over an industrial temperature range of –40°C to +85°C, making it suitable for aerospace, defense, industrial automation, and ruggedized edge computing applications.

The module features an integrated controller that manages wear leveling, bad block management, and error correction (ECC) to ensure long-term data integrity and simplify system integration. It supports JEDEC-standard eMMC 5.1 commands, operates from a single 3.3V supply with I/O at 1.8V, and provides sustained read/write speeds for OS boot, data logging, and code storage. 

Mont Taylor, Vice President of Business Development at Teledyne HiRel, noted that the module offers a drop-in solution with long-term supply assurance for space-constrained, mission-critical systems. The eMMC module is available now, supporting multi-year program lifecycles with consistent availability.