EV Group introduces LITHOSCALE XT for high-volume digital lithography

EV Group (EVG) announced the LITHOSCALE XT maskless exposure (MLE) system, designed for high-volume-manufacturing (HVM) heterogeneous integration applications. The system features a dual-stage design, up to six exposure heads, a dual-wavelength direct laser source, and hardware and software enhancements, offering up to five times the throughput of EVG’s previous LITHOSCALE system at comparable resolution.

It supports applications such as multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC), panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive uses.
The LITHOSCALE XT addresses challenges in heterogeneous integration, where multiple dies are assembled into a single package, requiring flexible design and accurate wafer reconstitution.

Unlike traditional mask-based systems like steppers, which face issues with die-placement inaccuracies, die-shift variations, and reticle size limitations, the LITHOSCALE XT enables stitch-free, full-wafer patterning with sub-2-micron resolution. It supports 300-mm wafers or 300-mm x 300-mm panels, real-time wafer-level distortion and die-sh...