Next-gen acid copper electroplating process for advanced semiconductor manufacturing

MacDermid Alpha Electronics Solutions Launches MICROFAB SC-40 PLUS to meet the latest advancements in semiconductor manufacturing. MICROFAB SC-40 PLUS represents a leap forward in semiconductor manufacturing with a transformative solution addressing demands for increased miniaturization and advanced packaging for artificial intelligence (AI), the internet of things (IoT), and mobile devices. This technology combines precision, efficiency, and ease of use, allowing fabricators to meet the industry’s requirements for high performance and enhanced reliability in advanced applications. With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS provides a high-purity deposit with superior within-wafer, within-die, and within-feature uniformity, delivering high reliability and optimized process cost for semiconductor fabricators. The versatile chemistry is suitable for bump, pillar, and RDL metallization while also compatible with and without a nickel barrier process for Kirkendall void (KV) free stacks. MICROFAB SC-40 PLUS provides a high-purity deposit with cutting-edge uniformity.
"MICROFAB SC-40 PLUS is a significant advancement in semiconductor manufacturing," explains Ashley Kuppersmith, Product Manager – Wafer Level Packaging at MacDermid Alpha. "It of...