AOS Semiconductor launches DFN packaged power devices with double-side cooling

Alpha and Omega Semiconductor introduces the AONA66916, an innovative 100V MOSFET packaged with top and bottom side cooling DFN 5 x 6 package. With this offer AOS now presents a state-of-the-art cooling solution, empowering engineers to develop more efficient designs, particularly in telecommunications and industrial sectors operating in harsh conditions. Traditionally, the standard DFN 5x6 package relies on bottom contact for cooling, transferring heat generated by Power MOSFETs to the PCB. This necessitates extensive thermal management considerations. AOS' novel top and bottom cooling DFN 5x6 package revolutionizes this paradigm, ensuring optimal heat transfer between the exposed top contact and heat sink. With a large surface contact area construction, the AONA66916 achieves a remarkably low thermal resistance (Rthc-top max) of 0.5°C / W, significantly enhancing thermal performance and reducing reliance on PCB thermal management. Moreover, maintaining the same 5mm x 6mm footprint as AOS' standard DFN 5x6 package streamlines integration without requiring modifications to existing PCB layouts. The AONA66916 leverages AOS' 100V AlphaSGT technology, ensuring best figure of merit (FOM) for balanced performance in hard switching applications. With a maximum R DS(on) rating of 3.4mOhms and a junction temperature rating of 175°C, this MOSFET offers unparalleled reliability an...