HANMI Semiconductor launch its new semiconductor equipment for HBM
Date: 08/09/2023
The DUAL TC BONDER 1.0 DRAGON, a second-generation model of crucial High-Bandwidth Memory (HBM) process equipment for artificial intelligence (AI) semiconductors, was just released by HANMI Semiconductor. It is specifically designed for the fabrication of semiconductor memories.
DS Kwak, vice chairman of HANMI Semiconductor, explained, “The second-generation DUAL TC BONDER 1.0 DRAGON is an advanced bonding equipment for HBM production that stacks semiconductor chips manufactured by the TSV method on wafers. It has recently received keen attention as a key element for learning and reasoning big data used in artificial intelligence operations.”
HANMI Semiconductor said it has so far applied for 106 patents for bonding equipment. A company official said, “We are gaining the upper hand with unique technology and durability, and we expect the competitiveness of the equipment to increase further.”
Hanmi quoted a latest market data by Gartner where the artificial intelligence semiconductor market is expected to start at USD 34.3 billion in 2023, grow at an annual average rate of 16%, and occupy USD 98 billion in 2030 and is expected to occupy 31.3% of the total system semiconductor market in 2030.
HANMI Semiconductor is an official sponsor of SEMICON China, which is held annually in Shanghai, China, and SEMICON Taiwan, which is held in Taipei, Taiwan.
HANMI Semiconductor plans to introduce ‘TC BONDER CW’ (Thermo-Compressor Bonder Chip to Wafer), a 2.5D package type applicable to TSMC ‘Chip on Wafer on Substrate (CoWoS) Package’ at SEMICON Taiwan to be held in September and actively engage in global marketing activities with related customers such as ASE, Amkor, and SPIL.
