Silver nanoparticle paste for die-attach applications from Toyo Ink

Toyo Ink has developed a silver (Ag) nanoparticle paste for die-attach applications. The newly developed lead-free material can be sintered at low temperatures under both pressureless and pressure-assisted methods. It has been engineered to meet the need for higher heat resistance and heat dissipation properties of electrical interconnects used in next-generation power electronics, such as silicon carbide (SiC) devices. Sintered joints using Toyo Ink’s nano-Ag pastes achieve high bond strengths of 40 Mpa and higher, making it possible to sustain the high-temperature operations of high-power semiconductors used in electronic applications such as electric vehicles, radio frequency (RF) transistors and light-emitting didoes (LEDs). Today’s power semiconductors are increasingly required to have high heat resistance and heat dissipation characteristics to meet the industry trends of package miniaturization, increasing wafer sizes, and greater switching frequencies and power densities. Traditional electrical interconnections based on tin or resin cannot meet the needs of such high-power devices due to their poor electrical and thermal conductivities. Addressing the need for more reliable and better performing interconnects, Toyo Ink researchers in Japan turned to silver paste as a die-attach solution.