Murata’s New Multi-Protocol Wireless Module Enables Simultaneous Use of Wi-Fi 6 and Matter

Exploring new opportunities in wireless communication, leading electronics manufacturer Murata introduces its latest engineering innovations at Embedded World 2023, Nuremberg. (14th - 16th March. Hall 4A Stand 4A-645) Featuring the company’s proprietary expertise, the new LBES5PL2EL module is highly optimized to meet the exacting demands of next generation IoT hardware - where having MatterTM connectivity is set to become an increasingly important expectation. This module is based on a highly-integrated IW612 single-chip 2.4/5GHz solution from NXP, which covers a broad array of different wireless protocols. Through this, 1x1 dual-band Wi-FiTM (IEEE 802.11a/b/g/n/ac/ax), Bluetooth 5.3 and IEEE 802.15.4 are all incorporated into the Murata tri-radio module. Inclusion of LE Audio functionality is another important plus point, especially in relation to voice-controlled products. This latest generation of Bluetooth technology delivers heightened performance, while drawing less power, and is predicted to replace many of the current BR/EDR Bluetooth-based audio connections in the near future. Also being made available is the LBEE5PL2DL module. This is based on the NXP IW611 device and features both Wi-Fi 6 and Bluetooth 5.3 support. Among the intended applications for these newly announced modules will be home automation equipment, digital assistants, smart domestic applia...