Murata's IoT wireless module deliver Wi-Fi 6 and Bt 5.3 in small size

Wireless module vendor Murata developed Type 1XL high performance Wi-Fi 6 and Bluetooth 5.3 module by using semiconductor chips from NXP Semiconductors. Murata has its own proprietary packaging and miniaturization technologies in developing highly reliable low power, small form factor wireless modules to connect things to Internet at lesser cost. Measuring 19.1 mm (L) × 16.5 mm (W) × 2.1 mm (H) is targets IoT, smart home, audio/video/voice, smart TV, and gateway applications which require less power and less space. “The wireless communication bandwidth is tightening within our homes and offices with more streaming content, such as 4K/8K video, and traffic increase by teleworking and remote video conference calls,” says Akira Sasaki, manager of the IoT Module Department at Murata. “The low cost, space-saving Type 1XL module enables high-speed communication, which significantly improves quality.” Powered by NXP 88W9098 combo chipset, the ultra-small dual-band module supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy (LE). The Wi-Fi section of the module supports connectivity up to 1.4x faster than conventional Wi-Fi compatible devices, offering data rates of up to 1200 Mbps. This section also supports the PCIe 3.0 interface with optional support for SDIO 3.0. The Bluetooth 5.3 LE section supports speeds o...