OMNIVISION has introduced the OG12S10, a new 12-megapixel (MP) backside illuminated (BSI) global shutter (GS) CMOS image sensor designed for factory automation and intelligent transportation systems (ITS). A global shutter captures every pixel in a frame at exactly the same moment, which avoids the distortion that can occur with rolling shutter sensors when capturing fast-moving objects. The OG12S10 features a large 3.45-micron pixel, offering strong sensitivity and high quantum efficiency, meaning it converts a larger share of incoming light into usable signal. It also supports an ultra-short exposure time of 1 microsecond, enabling precise control in high-speed motion scenarios.
The OG12S10 uses OMNIVISION's PureCel Plus-S pixel technology, includes on-chip dual conversion gain (DCG) for high dynamic range (HDR) imaging, and offers a resolution of 4096 x 3072. The sensor's Nyxel near-infrared (NIR) technology enables clear image capture with high pixel sensitivity and no motion artifacts, while its 12-bit analog-to-digital converter (ADC) further improves overall image quality. With a maximum frame rate of 75 frames per second, the sensor can easily capture fast-moving objects without blur.
Kelly Yan, staff marketing manager at OMNIVISION, said that in situations involving constant speed, vibration, and motion, maintaining image clarity becomes critical, but not all image sensors are equipped to deliver the consistency these conditions demand. She said global shutter sensors like the OG12S10 address this challenge by capturing each frame with synchronized exposure, eliminating motion-related distortion.
Key features of the OG12S10 include its 12MP resolution at 4096 x 3072; a 3.45-micron BSI pixel in a 1.1-inch optical format; 74dB of dynamic range using DCG HDR; a full well capacity of 20,000 electrons with read noise of just 2.8 electrons in DCG mode, meaning it can capture a wide range of light levels with minimal electronic noise; Nyxel technology delivering high quantum efficiency of 60% at 850nm and 40% at 940nm, a 5x improvement over OMNIVISION's existing 3.45-micron sensors; an ultra-short exposure time of 1 microsecond; 106dB of shutter efficiency, a measure of how well the sensor avoids unwanted light contamination between exposures; PureCel Plus-S die-stacking technology; and support for both a 16-lane sub-LVDS interface running up to 1.1Gbps and a 4-lane MIPI interface.
The OG12S10 comes in a ceramic land grid array (CLGA) package and will be available for sampling in November 2026, with mass production expected in the fourth quarter of 2026. OMNIVISION will also be showcasing the sensor at the VISION Show, Hall 10, Booth 10D10, taking place in Stuttgart, Germany, October 6-8, 2026.
