MACOM 3.2T chipset solution for high-speed optical connectivity launched

MACOM Technology Solutions announced a front-end chipset solution for 3.2T applications. The solution is intended for optical interconnects used in AI infrastructure, cloud data centers and high-speed networking applications.

The chipset supports up to 3.2T throughput through eight channels operating at 448 Gbps PAM-4. It combines MACOM’s new transimpedance amplifiers (TIAs) and photodiodes in a receiver platform with its previously introduced 448 Gbps PAM-4 drivers on the transmit side. The company stated that offering key transmit and receive building blocks from a single supplier allows customers to simplify development and address overall link performance.

Stephen G. Daly, President and Chief Executive Officer of MACOM, said: “MACOM’s 3.2T chipset solution has been engineered and optimized as a platform, helping customers optimize link performance while reducing development and qualification efforts.”

Receive-Side Components for 448 Gbps PAM-4 Optical Links  
The receive-side solution pairs photodiodes and TIA technologies for 448 Gbps PAM-4 optical applications.

It includes the MATA-42754 and MATA-41754 quad linear TIAs. These devices support the bandwidth requirements of the optical links and incorporate RSSI functionality for photo alignment and power monitoring. They also provide digital control of bandwidth...