ACCM Unveils Celeritas SMC, a Silicon-Matched Core for Advanced Chip Packaging

Advanced Chip and Circuit Materials (ACCM) has introduced Celeritas SMC (Silicon-Matched Core), a production-ready core material for advanced IC substrates, engineered to match silicon's in-plane coefficient of thermal expansion while running on established organic-substrate manufacturing lines. Shipping now from ACCM's Wisconsin facility, the material is designed for large-body chiplet packages, embedded-bridge architectures, and other advanced packaging types where conventional organic cores are increasingly hitting warpage and thermomechanical reliability limits.

Celeritas SMC is intended to deliver the low CTE, stiffness, dimensional stability, and electrical performance that have driven industry interest in glass core, without requiring through-glass vias, glass-specific metallization, brittle-panel handling, or a full retooling of existing production lines.

As AI and high-performance computing packages continue to grow in size, the materials beneath them are struggling to keep pace. With package bodies now exceeding 100 mm per side and silicon bridge dies embedded directly into substrates, the thermal expansion mismatch between conventional organic cores (roughly 12 ...