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  Date: 20/10/2016

Akrion achieve a process success for 450mm semiconductor tech

Akrion Systems, in partnership with SUNY Polytechnic Institute (SUNY Poly), and the Global 450mm Consortium (G450C), has released a batch process for 450mm semiconductor wafers in which silicon nitride can be selectively removed. This new technique is set up via the use of specially built “tanks” which allows exact films to be portrayed on up to five 450mm wafers at a time to more easily create the nanoscale infrastructure needed to manufacture computer chips on the larger sized silicon substrate.

Akrion Systems has provided equipment to the five member companies of the consortium: such as Intel, TSMC, GLOBALFOUNDRIES, IBM, and Samsung. Akrion Systems has developed prototype equipment for both single wafer and batch immersion applications and at present it providing the needed process solution for the consortium.

Akrion Systems President and Chief Executive Officer Michael Ioannou said, “With industry interest in expanding semiconductor wafer sizes from 300 to 450mm to improve efficiencies for enhanced productivity, we are pleased to be able to play a small part in this important endeavor, showcasing our technological development capabilities in the process.”

Akrion Systems Vice President for Applications and Technology Dr. Ismail Kashkoush said, “Akrion Systems has always valued research and development work to expand our capabilities and provide our customers with the best possible equipment to give them competitive advantages. The task to provide equipment for the future 450 mm wafer size was a difficult challenge, but it is one in which we were proud to not only meet, but also exceed expectations.”

Engineering Director of CMP / Thermal / Cleans for G450C, Daniel França, said, “Akrion Systems has successfully demonstrated a batch selective silicon nitride removal process at 450mm. By meeting the process targets in the equipment performance metric (EPM), defined by the consortium, and by making this process capability available, it moves the G450C a step closer to providing front end of line (FEOL) test structures for advanced module development, further expanding the consortium’s technological resources and abilities.”

The G450C is focused on establishment of 450mm wafer and equipment development environment. The main view of the G450C is to be a public-private tie-up program (New York State (SUNY Poly), Intel, TSMC, Samsung, IBM and GLOBALFOUNDRIES) that grows profitable test wafer fabrication infrastructure, equipment prototypes and high-volume tools to set-up a coordinated industry transition to 450mm wafers.

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