Samtec backplane connector optimized for speeds up to 28 Gbps

Samtec is expanding its ExaMAX high-speed backplane connector system optimized for high-density and high-speed performance. The scalable ExaMAX system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85 ohms and 100 ohms systems due to targeting the 92 ohms specifications and controlling reflections at all geometry transitions within the connector. Samtec claims, highly-reliable ExaMAX system meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment. The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. The 2.00 mm-pitch, 40-differential-pair ...