EV Group joins IRT Nanoelec 3D Integration Program

EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium. Based in Grenoble, France, IRT Nanoelec is an R&D center focused on information and communication technologies (ICT) using micro- and nanoelectronics. 3D integration is one of its core programs. The 3D integration program was launched in 2012. It brings together, under a single roof, expertise and equipment addressing the entire 3D integration value chain: technology, circuit architecture, EDA tools, packaging and test. Mentor Graphics (EDA), ST (foundry) and Leti are the founding members of the consortium. “The development of permanent bonding equipment and processes geared towards high-volume manufacturing of 3D stacked devices has been a focus area for EVG for more than 15 years. We are excited about the opportunities that result from joining forces with CEA-Leti, STMicroelectronics and Mentor Graphics to further develop and prove our solutions for advanced 3D technologies, such as 3D partitioning and advanced 3D imaging sensors,” s...