LTE stack from NextG-Com on ConnX BSP3 processor core

LTE Protocol Stack from NextG-Com now Available on Cadence Tensilica Processor. The ALPS520 LTE Layer 2 and 3 protocol for the Cadence Tensilica ConnX BSP3 processor core used in desiging of LTE modems for cellular phones, tablets and other end-user equipment. The NextG-Com ALPS520 LTE protocol stack implements Layers 2 and 3 for FDD and TDD User Equipment (UE) terminals compliant to 3GPP Release 11. The ALPS520 is fully tested against 3GPP 36.523 conformance tests. The protocol stack components also come with a host of tools (Trace, ASN.1, SE-RTOSTM), which aid in faster product development. The ConnX BSP3 core is an optimized LTE Layer 1, 2 and 3 dataplane processor (DPU), ideal for system control and layers 2 and 3 protocol stacks. This core, coupled with the ConnX BBE DSP cores and the ConnX SSP16DPU, enables SoC developers to quickly implement software-programmable wireless communication modems. “The NextG-Com team has developed a modular architecture protocol stack, leveraging the enhanced features of the BSP3, which is optimized for the low-level bit manipulation typical of L1 and L2 functionality,” stated Eric Dewannain, Cadence’s senior group director of baseband products. “Together with NextG-Com we can offer customers a total solution for fast implementation of LTE mobile devices.” “The Tensilica ConnX BSP3 core offers a very small size and low-power ...