MEMS for mobile with stands higher mechanical shock and temperature

STMicroelectronics has unveiled a new MEMS accelerometer designed to withstand higher temperature and mechanical shock to support latest sleek mobile phones, which are vulnerable to thermal variation and bending. ST says its new LIS2HH12 3-axis accelerometer introduces an innovative mechanical structure and dedicated processing to deliver consistent and stable high performance in thermally challenging conditions inside ever-slimmer portable applications. “The innovative architecture of our new accelerometer represents a significant advance in the design of MEMS devices,” said Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics. “This next-generation device addresses the need of the mobile industry for higher performance and stability in advanced motion-sensitive applications.” The key features of LIS2HH12 as explained by STMicroelectronics: The LIS2HH12 is housed in an ultra-small 2mm x 2mm x 1mm package, giving designers extra flexibility to meet pc-board layout rules for wireless handsets, and helping achieve a low overall handset profile. The accelerometer has selectable full-scale range of ±2, ±4 or ±8 g and a 16-bit digital output, an integrated temperature sensor, industry-standard I2C and SPI interfaces, a wide analog supply-voltage range of 1.71V to 3.6V, and two programmable interrupt generators th...