Thermally and mechanically robust 30-100V range MOSFETs for Automotive apps

NXP Semiconductors N.V. has introduced 54 new automotive-qualified MOSFETs in an LFPAK56 package. NXP’s LFPAK56 MOSFETs are designed to save more than 55 percent of the footprint area compared to DPAK. The LFPAK56 MOSFETs are suitable for a wide range of automotive applications, particularly in the areas of powertrain; body and security; and chassis and safety. “The mechanical robustness and excellent thermal performance of LFPAK56, combined with its small footprint, make it ideal for high-reliability automotive applications. The proven quality of NXP’s integrated copper clip technology – along with the breadth of our MOSFET portfolio – have made it a popular choice for designers who want to select the power MOSFET with the right parameters for their application,” said Jamie Dyer, international product marketing manager, NXP Semiconductors. NXP LFPAK56 power MOSFETs are available at voltage grades of 30V, 40V, 60V, 80V and 100V, with low RDS(on) performance and current handling capability. Examples highlighting the range of the portfolio include: BUK9Y3R0-40E. With a low RDS(on) of only 3.0 miili ohms at 40V, and the ability to handle currents as high as 100A, this part is ideal for motor drive applications such as those found in seat control, window lifters, windscreen wipers and other body control applications as well as pumps and fans. BUK9Y59-60E. With an RDS(on) of...