New HyperLynx accelerates simulation performance up to 5X faster

The new release of HyperLynx from Mentor Graphics supports advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance up to 5X faster. HyperLynx helps in analyzing potential high-speed design issues arising from signal integrity, power integrity, and electromagnetic interference (EMI) performance. “In applications above 10 Gbps, insertion loss will often exceed -12 dB at the Nyquist and eyes will be completely closed. Successful designs require getting everything in the design right and building confidence in the design early in the design cycle with accurate simulations,” stated Eric Bogatin, signal integrity evangelist, Bogatin Enterprises, a wholly owned subsidiary of Teledyne-LeCroy. “The accuracy of the latest release of Mentor Graphics HyperLynx was recently validated with a 12.5 Gbps backplane design from Molex that included causal material models, copper surface texture contributions, via models, mode conversion and reflections from integrated S-parameter models of connectors.” The new HyperLynx product decreases the amount of channel modeling that requires 3D analysis with advanced area fill-aware 2.5D planar trace extraction. When this advanced feature is enabled, the system will model variations in signal trace impedance or delays due to non-ideal planes and references (complex area fills with voids and cu...