Infineon's 'Coil on Module' for both contact and contactless cards

Infineon Technologies AG has introduced its new 'Coil on Module' chip package for Dual Interface bank and credit cards, which are used for both contact-based and contactless applications. The new 'Coil on Module' package packs security chip and antenna that makes a radio frequency (RF) connection to the antenna embedded on the plastic payment card. RF link is used instead of mechanical connection to improve the robustness of the payment card and simplifies card design and manufacturing, making it more efficient and up to five times faster than with conventional technologies, as per Infineon. "We expect that worldwide introduction of contactless payment applications will accelerate thanks to our 'Coil on Module' technology," says Stefan Hofschen, President of the Chip Card & Security Division at Infineon Technologies AG. "Using our new chip modules, card manufacturers can manufacture Dual Interface cards much faster and more efficiently than ever before. The innovative 'Coil on Module' package technology underlines Infineon’s technology leadership and is based on extensive semiconductor and module expertise as well as profound understanding of card manufacturers’ systems and requirements," he adds. Infineon's explanation of technology and advantages/benefits: The card owner's individual data are stored on the security chip of the Dual Interface card and uploaded in a pa...