M2M modules from Telit feature dual-band 3G and GSM/GPRS/EDGE support

Telit Wireless has unveiled UE910V2HSDPA and HE910V2HSPA+ M2M modules based on Qualcomm's chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3GUE910V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3.6Mbps downlink data rate. The HE910V2 is based on Qualcomm Technologies MDM6200 chipset and delivers up to 14.4Mbps downlink and 5.76Mbps uplink data rates. The new products are fully compatible with Telit’s xE910 family and can be easily dropped into existing or planned designs for xE910 modules requiring no additional rework. Positioned at entry-level and mid-range respectively, the new Qualcomm Technologies-based UE910 V2 and HE910 V2 modules enable the Telit xE910 family to enhance cross-technology compatibility with its other popular global air-interface technologies. The application of the Qualcomm Technologies chipsets improves interchangeability between CDMA (1xRTT, EV-DO) and UMTS (HSDPA, HSPA+) variants making the adaptation of customer applications to regional technical requirements quick and easy, minimizing time to market and total cost of ownership. The QSC6270 based UE910 V2 is to be positioned as a 2G to 3G migration path product, and includes high-value features such as analog audio, making it ideal for applications from home and commercial ...