Date: 04/02/2013

TowerJazz's foundry to make flexible semiconductor chips

TowerJazz is offering first semiconductor foundry in the world with a CMOS process (CS18) available for physically flexible wafers and integrated circuits (ICs) utilizing FleX Silicon-on-Polymer.

FleX Silicon-on-Polymer is American Semiconductor’s chip making process to make flexible wafers that can be bent so that they can be placed on non-flat surfaces, and integrated with printed electronics to create flexible hybrid systems.

“FleX has been successfully demonstrated in various prototype processes,” said Rich Chaney, General Manager of American Semiconductor. “Partnering with TowerJazz to release FleX with their foundry CS18 process will greatly expand the availability of flexible ICs and is a benefit to the flexible electronics community.”

“FleX is a post-fabrication process that can be applied to our production SOI technology making it possible to turn any product into a flexible die helping our customers create new, differentiated solutions,” said Dr. Marco Racanelli, Sr. Vice President of TowerJazz. “We are excited to partner with ASI and look forward to jointly participating in the growth of this new market.”
Author: Srinivasa Reddy N