Date: 25th Aug 2010

TI introduces Microsoft Windows Embedded BSPs in OMAP and Sitara microprocessors

Texas Instruments has introduced Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). These packages provide well-tested drivers and source code, thus enabling developers to easily interface the supported devices to the operating system. The new system provides drivers and protocol stacks for chip integrated peripherals such as Ethernet, USB, CAN, SATA, LCD and touch screen controllers. For OMAP-L1x devices, the BSP provides access to TI's TMS320C674x DSP using DSP/BIOS Link inter-processor communication software. DSP/BIOS Link enables developers to easily access the DSP for algorithm development using Windows Embedded CE 6.0 R3.

The OMAP-L1x and AM1x board support packages are compatible with the following TI processors and associated EVMs:

OMAP-L137 processor
OMAP-L138 processor
AM1707 microprocessor
AM1808 microprocessor
AM17x Evaluation Module
AM18x Evaluation Module
AM18x Experimenter's Kit
OMAPL137/C6747 Floating Point Starter Kit
OMAP-L138/TMS320C6748 EVM
OMAP-L138 Experimenter Kit

Windows Embedded CE 6.0 R3 provides developers with the tools and technologies for conectivity with Windows-based PCs, servers and online services.

"Microsoft is excited to be collaborating with TI on its BSPs for Windows Embedded CE 6.0 R3, helping developers increase efficiency when building devices with OMAP-L1x and Sitara AM1x," said Kim Chau, senior partner manager for Windows Embedded. "Windows Embedded CE 6.0 R3 drives rich user experiences and seamless connectivity with the world of Windows, and TI's BSPs will further help developers improve efficiency while differentiating their devices."

Availability:
Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices are available for free download at www.ti.com/wincebsp-prtf.