Toshiba to immediately start shipping its newly launched photocouplers “TLP2767” and “TLP2367” for high-speed communications at data rates up to 50Mbps. SO6L package houses “TLP2767” to achieve both a creepage and clearance distance of 8mm and isolation thickness of 0.4mm for reinforced isolation and assures isolation voltage of 5000 Vrms (min). 5 pin SO6 package houses “TLP2367” with an assurance of creepage and clearance distance of 5mm (min) and isolation voltage of 3750Vrms. Both products are of 2.3mm (max) low-height packages and meet international safety standards including UL1577 and EN60747-5-5. The other specifications include the propagation delay skew of 10ns (max) that delay time of 20ns (max) with pulse width distortion of 8ns (max). In inverters, they can be used to reduce the dead time resulting in increased power efficiency. High output infrared LEDs reduce the threshold input current by approximately 20% at the input side when compared to the earlier products. The photo detector IC fabricated with a CMOS process at the output side reduces the supply current by approximately 50% when compared with Toshiba's existing products. These devices contribute to lower power consumption with cost reduction of systems. It further helps in contributing to lowering the operation voltage of systems as it assures to operate from a supply voltage of 2.7V to 5.5V, at temperatures up to 125 degrees Celsius. Applications include programmable logic controllers (PLC), I/O interface, photovoltaic (PV) inverters and FA inverters.