Memory Last update: 2nd Jun 2010
Top Stories
Sidense says no Kilopass patent infringement
Microchip sells its NAND flash memory property to Greenliant
Infineon and Elpida settle legal dispute over patent infringement
Robust market demand for semiconductor devices in 2010
Latest semiconductor market stats from SIA and IDC
The market growth to continue for semiconductor industry in remaining quarters of 2010
Video surveillance storage market is forecasted to grow over $5.6 billion by 2013
DRAM market growth momentum continuing
Samsung shipping 20nm NAND flash memory chips
Synopsys DDR memory IP supports Six DDR Standards in single PHY
Capacitor-less below 1V operating ZRAM chips made using bulk silicon can replace DRAM
Flash memory market to grow for another 10 years
Ramtron granted with US patent for it's Ferroelectric RAM
64 GB SDXC card from SanDisk for HD video recording apps
55 nm Embedded Flash process tech from ST Micro for making automotive MCU chips
Samsung begins volume production of 4Gb DDR3 DRAM chips at 40nm node
Fujitsu and University of Toronto developed reliable read-method for MRAM
2 Gb DDR3 DRAM chip jointly developed by Micron and Nanya
Intel and Micron's 25-nanometer NAND flash tech for consumer electronic gadgets
LSI and Seagate collaborate on solid-state storage tech
OTP memory IP from Sidense drives Audium's power amplifier chip
Samsung and Rambus settle their patent related disputes and claims
Merry times for Hynix Semi with its 4th quarter 2009 revenues rose
Future Electronics to sell and stock Ramtron chips
Year 2009 is not that bad for memory chip makers and 2010 going to be even better
40nm 2-Gigabit DDR3 SDRAM volume production shipment from Elpida
65nm XS Version 1-Gigabit DDR3 SDRAM from Elpida
Elpida receives "2009 Global Warming Prevention Activity Award"
Hynix Semiconductor's 2Gb DDR3 DRAM devices Validated by Intel
DRAM test lab opened in Munich Germany
Over a billion SoCs integrate flash memory interface IP components from Arasan Chip Systems
Agilent and Nexus deliver DDR3 memory bus debug solutions
Semiconductor industry's fast recovery in 3rd Q 09 is due to processor and DRAM demand
Indilinx, Cavium and Narinet collaborated to bring SSD into networking storage systems
Intel and Numonyx achieve stacking of PCM arrays to increase memory capacity
MagnaChip offers 0.11um, 30V process technology with small SRAM cell size
Logic Devices is sampling its first DDR2 DRAM modules
Elpida memory completes the development of the 40nm 2-gigabit DDR3SDRAM
Samsung producing 512-Megabit nonvolatile memory PRAM
Semiconductor industry is cautiously optimistic on next phase of growth
IBM's on-chip DRAM prototype technology achievements
Moser Baer is quickly gaining share in USB flash memory market
DDR3 based threaded module prototype for multicore computing
Ramtron settles product defect claim of its memory product
SPMT's abridged technology specifications for mobile devices
LSI retained its top position in Host Bus RAID Controller market with further growth
Ramtron secures $6 million credit from Silicon Valley Bank
8.5 GB DVD media launched by the Moser Baer
Toshiba is shipping 43nm NAND flash in volumes to laptop OEMs
IDT powered by Tundra's expertise is allying with Micron to develop PCIe SSDs
FRAM chips from Ramtron are selected for high-rel SSD
Rambus unfolds DRAM innovations beyond DDR3
New industry consortium to promote serial interfaced DRAMs
Transistor-less semiconductor memory denser and faster than NAND
Joint development of NAND flash memory controllers by Hynix, Numonyx and Phison
Toshiba to make single chip flash memory of 32 Gb capacity using 32nm process
Rambus buys Inapac patents related to System-in-Package solutions
Samsung producing NAND flash chips in 40-nm process technology
Hynix agree to compensate Rambus for using its technology in SDR and DDR SDRAM
Q4 2008 revenues freeze semiconductor industry to a dope less silicon
Ramtron to make its FRAM chips using IBM foundry
Toshiba achieves 3-bit-per-cell 32Gb record in NAND Flash capacity
Taiwan's DRAM vendor Powerchip semiconductor posts 1.603 billion NT$ revenue for Jan-09
SST revenues for 4Q08 were $58.4 million compared with $92.4 million in 3Q
Rexchip earns TOSHMS certification
Detailed study of possibility of a $20 Laptop computer
John Kispert is the new CEO and Director of Spansion
Innovation in DRAM focuses on package and speed
California Federal District Court halts Rambus patent infringement case Against Micron
New security technology for 2.5-inch encrypted hard disk drives
Chang-Soo Choi is now the President and CEO of Samsung Electronics America
Intel's another legend Craig Barrett to Retire in May
Technology to transfer data from DRAM chips to processor @ 1 terabyte per second
Vanguard International Semiconductor reports 2008 revenue of NT$16,120 million
Qimonda is shipping Rambus XDR DRAM in volumes to PlayStation3 gaming systems
Spansion has planned to sell its business or get merged with other similar company
Micron works with Sun Micro to achieve one million write cycles in NAND flash
Smallest Fin-FET SRAM cell with high-k/Metal gate material
Hitachi GST and Intel to jointly develop Solid State Drives (SSD)
NAND Flash to be mass-produced at 34 nm by Intel and Micron
DRAM vendors Powerchip and Elpida engaged in close talks for a possible merger
Rambus complaints on NVIDIA to International Trade Commission over patent infringement
UMC to make SRAM chips at 28nm node
Samsung steps back from acquiring SanDisk
Z-RAM memory technology breakthrough by Innovative Silicon
Synopsys and Ovonyx team-up in developing simulation models for Phase-change RAM
India's automotive electronic growth opportunities
ISSI opens sales office in Chennai
Hynix and Toshiba to cross license patents and products
Texas Instruments to make 4 MB FRAMs for ATMEL
Renesas and Powerchip agree for a joint venture to design memory devices
Intel ships in volumes it's 1GB, monolithic NOR flash memory chips to mobile phone makers ST Micro gets one NAND license from Samsung Drag and drop solution announced by Altera and Northwest logic for 667-Mbps DDR2 SDRAM interface in Stratix II FPGAs Samsung’s new flash memory development has extended maximum memory capacity of NAND flash memories to 256 MB and a scaling down to 20 nano meters Samsung semiconductor is anticipating to mass produce Phase change Random Access Memory (PRAM) by 2008
New Products
Ramtron serial 1-Mbit F-RAM is automotive qualified
Samsung launches multi chip packaged PRAM devices for mobile phones
2-Gb LP DDR2 DRAM from Micron for ultra-portable computers
Power controller for DDR memory chips from Exar
Intel's new SATA Solid-State Drive (SSD) at $125 for dual drive computers
Integrated serial presence detect EEPROM memory and temperature-monitoring IC
Inphi samples JEDEC-compatible memory buffer to support more memory modules
Embedded DRAM Buffer ICs from NEC Electronics for mobile graphics apps
2-terabyte hard disk drive from Samsung Electronics for desktop systems
30 nanometer, 2Gb green DDR3 DRAM for handheld embedded devices
Integrated NV memory, gamma-correction reference systems with MTP memory
Hynix Semiconductor develops 2Gb DDR2 DRAM for mobile electronic devices
128GB, 32nm Multi-Level Cell NAND-flash-based SSDs from Toshiba
SD 3.0 / eMMC 4.4 Card Controller IP targeting HD multi-media content on handheld devices
2Gb GDDR5 DRAM from Hynix Semiconductor based on 40nm tech
High-density 64GB embedded NAND flash memory device from Toshiba
New SSD memory from Micron targeting notebook and desktop computers
Samsung's new 30nm-class 32Gb MLC NAND flash memory chips
Mid-range and enterprise disk storage systems from Fujitsu
Elpida sampling 32-bit I/O 2-Gigabit DDR2 SDRAM
LSI storage devices inside Cray's supercomputer
Memory device packs 4Gb NAND flash and 2Gb DDR DRAM
256Mbit Serial Flash from Macronix for high storage space apps
34nm MLC NAND flash memory from Micron for enterprise storage with 6x endurance
A 65-nm, 144-Mbit monolithic SRAM from Cypress Semiconductor
PWM controllers from IR for DDR3 memory modules
New 54nm 1Gb DDR3 from Hynix Semiconductor consumes 30% less power
New Magnetoresistive RAM devices from e2v for defense, avionic apps
New serial nvSRAMs from Cypress Semiconductor in the range of 16Kb to 8Mb
New MaxArias RF-enabled wireless memory devices from Ramtron
High speed/density battery-free non-volatile RAM from AGIGA
Elpida developed 2Gb DDR2 Mobile DRAM
SanDisk's Extreme Pro CompactFlash memory cards with Read/Write speed of 90MB/s
Eight-layer through Silicon Via based multi-layer 8-gigabit DRAM from Elpida
16-Kilobit F-RAM memory to meet AEC-Q100 grade 1 automotive standards
Moorestown Platform now supports 4Gb Mobile DDR SDRAM from Hynix
3 bit-per-cell 34nm NAND flash technology jointly by Intel and Micron
SC70 packaged op amp consumes little power of 0.55 microwatt
Intel's 34-Nanometer NAND flash SSDs
Vertical-Mount, SMT DDR2 DIMM socket with low lead coplanarity from Fujitsu
New 256 Kb F-RAM devices with SPI and I2C serial interfaces from Ramtron
New high speed SRAM family from Renesas targeting switches and routers
STMicro packs 512-Kb of storage capacity in EEPROM of size 2 x 3mm
New 8-Megabit F-RAM from Atmel pin-compatible with SRAM
SAMSUNG develops SATA SSD in mini-card size for netbook computers
Micron's new low power DDR3 memory module for portable computers
eMMC4.4 standard based NAND flash memory devices from Micron
Spansion unveiled new 32-128 Mb flash memory with SPI interface
FCRAM ICs withstanding 125 Deg C temperature with DDR SDRAM interface
Hynix developed mobile 1Gb DDR2 DRAM using 54nm process technology
Serial FRAM in 512 Kb and 1 Mb capacities; alternative choice for NOR flash
Microchip specializes its EEPROM by offering in smallest packages
SAMSUNG started shipping 16GB DDR3 DRAM memory modules for servers
Hynix Semiconductor validates MetaRAM based 8GB DDR3 RDIMM
Block-abstracted 8GB and 16GB NAND flash memory for media players
Less space consuming SD Card interface IC for cell phones
New SSD memory controllers support external DRAM interfaces
New EEPROM chips operating at 1.5 Volts for both read and write operations
1.2Gb and 2.5Gb DDR1 integrated memory modules for hi-reliability apps
Flash memory controller for SSD, and CFCs
New NAND flash, DRAM, and software from Micron to kick-start the growth
DSCC approved 32Mb & 64Mb hermetic flash memory modules
First validated 40-nanometer class DRAM
Samsung releases 4Gb DDR3 DRAM chip amid the weak memory market
256-Kilobit serial F-RAM with I2C interface
Serial SRAM with SPI interface for embedded system applications
1-Gigabit XDR DRAM works at speed of 7.2 GHz
Long-wire ZIF probe tips for DDR, GDDR memory validation
4-Megabit F-RAM memory in FBGA package
512GB solid state drive using 43nm Multi-Level Cell NAND
1Gb+ serial NAND flash memory for embedded applications
Hynix is first in achieving 2Gb capacity in single package Mobile DRAMs
7Gbps, 1Gb GDDR5 Graphics DRAM
512-Kilobit Serial F-RAM with high-speed read/write performance
16 Gb monolithic flash memories manufactured using 43nm technology
Atmel's Low Power 1.8V 8-Megabit Serial Flash
NAND flash chip of 32 Gigabit in TSOP package
Hynix 512MB mobile DDR SDRAM works at 185 MHz
Samsung's new 8GB NAND is shipping in samples to mobile-phone makers
ST Micro Automotive grade NOR flash available up to 32 Mbit capacity
10MHz, 32Kbit SPI serial EEPROM from Microchip
Samsung develops 1GB low power DDR memory for cellphones
SST releases new 16MB 1.8V flash memory.
Serial flash memory with 16M capacity and each sector of 4K bytes. Ramtron’s FM3130 is with 64KB of FRAM and real time clock/calender FRAM of 512KB with SPI in 8 pin TDFN package with a max price tag of $7.62 Micron leads the market by releasing 1Gbit DDR3 RAM Blue ray discs of mammoth 50 GB capacity available from TDK
Design Guide
Flash memory chips for your embedded design
The next generation of NonVolatile RAMs (NVRAM)
