Memory Last update: 8th Jan 2012
Top Stories
Broadcom licenses Rambus patents
Panasonic, Samsung, SanDisk, Sony and Toshiba collaborate on SD Card security
Non-Volatile DIMM memory can save the desktop computers from using UPS
Walton to purchase from Elpida 7,500 preferred shares in Elpida subsidiary EBS
AMD branded DRAM memory modules available now in N.America
Toshiba develops tech for embedded SRAM to operate from wide Vcc of 0.5V to 1.0V
Inphi's iMB enabled LRDIMM modules validated by Intel
DRAMeXchange reports 19.4% fall in DRAM revenue on q-o-q basis
IDT's low-power dual-port memory in Samsung GALAXY Tab
NAND flash: 2xnm-node chips to gradually replace 3xnm-node chips
Tablets are seen as fast growing market for DRAM makers
Invensas uses IDT's DDR3 register in its xFD memory stacking technology
Elpida Memory filed a lawsuit against Nanya Technology for patent infringement
JEDEC advances DDR4 Standard with reduced power usage
IDT and Dell to present NVMe specs at the flash memory summit on Aug 9-11
Elpida sampling 2Gb DDR3 SDRAM made using 25nm process
Georgia researchers develop memory devices based on piezoelectric nanowires
Toshiba opens new 300mm fab in Japan to make 24nm NAND flash chips
Hynix and Toshiba collaborate to develop NV memory; MRAM
Imec brings down the leakage current in DRAM at lower EOT of 0.4nm
imec stacks DRAM over logic chip and connects them by TSV and micro conducting bumps
IBM researchers mitigate the problem of short-term drift in multi-bit PCM memory
Elpida makes 0.8mm DRAM package by using PoP tech
DRAMeXchange forecasts the weaker shipment momentum of NAND flash
JEDEC publishes e-MMC standard update v4.5
Elpida employs HKMG tech to make 2Gb LPDDR2 DRAM
DRAMeXchange: DRAM contract price fell by 2.74%
Mobile memory market is forecasted to grow by 25.7% to reach $16.4 billion in 2011
Open-Silicon to tech-support Micron hybrid memory cube technology
Super fast growth of tablet is driving DRAM market
Embedded NOR flash memory market in 2011 is set to grow 8 percent to 3.96 billion units
DRAM Module shipment to grow by 10.8% in 2011, predicts IHS iSuppli
Elpida, PTI, and UMC partner on 3D fabrication of semiconductor devices at 28nm
DRAMeXchange: Price increase momentum of DDR3 due to Japanese quake weakening
MRAM demand drives Everspin sales expansion
Inphi's memory buffer validated by Intel
Silicon oxide based memory chip to be tested in space for radiation
DRAMeXchange: Supply of NAND flash not affected by the Japan's quake
Spansion GL-S NOR Flash Memory enters production
Ramtron selects KYEC for assembling and testing of its F-RAM chips
Spansion and SMIC expand foundry agreement
DRAMeXchange forecasts overall notebook shipment to up by 6.5% in 2011
Rambus to acquire Cryptography Research for $342.5M
DRAMeXchange predicts DDR3 2GB contract price of US$20 in short term
Worldwide DRAM revenue declined by 4.0% in 1st Q 2011
Elpida Memory to commence mass production of its 30nm process DRAM in May
Semiconductor vendor ranking in 2010; the movers and shakers as per IHS iSuppli
Rexchip successful in pilot run of Elpida's 30nm 2Gb DDR3 DRAM
Notebook/netbook shipment slowing from 30% Y/Y growth in 2010 to 27% in 2011
Sidense 1T-OTP available in ON Semiconductor 180 nm process
Rambus renews patent license agreement with Toshiba
Japan tremors and tsunami will pass through the global semiconductor industry
Vimicro PC-CAM Processors uses Kilopass' NVM memory IP core
JEDEC publishes standards for flash memory based UFS
Tablets and smartphones enable fast growth in NAND flash consumption
Eric A. Balzer is appointed as CEO of Ramtron
Rambus achieves differential memory signaling of 20Gpbs
Powerchip to become 100% semiconductor foundry service provider
Hynix Semiconductor reported a sequential quarterly revenue drop of 0.5 trillion Won in 4Q10
Researchers develop single memory chip for system and content storage
Change in management positions at Ramtron
Sidense Memory IP Qualified in 180nm, 130nm and 65nm GLOBALFOUNDRIES Processes
Hard Disk Drive market is still not affected by SSD due to cost factor
iSuppli forecasts a fall of 11.8% in worldwide DRAM revenue in 2011
Lithography based semiconductor chip making after 15nm is less certain
Strategy Analytics's tech predictions for 2011
Rambus renews its patents license agreement with Renesas
Toshiba slims its chip manufacturing resources to become fablite
JEDEC's Flash memory standards UFS is under fast progress of implementation
Magnetic hard disk drive growth less affected by solid state memory drives
Soitec buys Altatech Semiconductor's wafer inspection system
Rambus sues Broadcom, Freescale, LSI, MediaTek, NVIDIA, and ST for patent infringement
Elpida sampling 2Gb DDR3 SDRAM for consumer devices
SanDisk, Sony and Nikon co-develop new specs for media storage in memory cards
Graphics DRAM heading downwards, forecasts iSuppli
NAND type flash memory revenue to grow by 38% to reach $18.7 billion in 2010
Elpida is shipping samples of its 32-Gigabyte LRDIMM
Record booking for single transistor per cell ROM tech expert Sidense
ZTE selects Cypress's SRAM devices for its Ethernet switches
Samsung starts mass producing 40nm-class 8GB DDR3 Module for portable apps
ATMI and Ovonyx progress towards commercialization of PCM devices
Hynix joins hands with HP to develop memristor semiconductor devices
Toshiba starts mass production of its 24nm, NAND flash memory
Sidense granted anti-fuse memory cell patent by USPTO
Intel and Micron to jointly develop 3bpc NAND flash memory chip on 25nm process technology
Rambus grants NVIDIA patent license for certain memory controllers
Plastic computer memory device demo using spintronics tech
Ramtron starts commercial sampling of its MaxArias Wireless Memory
Hynix begins mass production of its 64Gb NAND flash using 20nm process
IC Insights: DRAM vendors to rank up as total semiconductor sales to top $204B in 2010
Elpida to make new NAND flash based on Spansion's MirrorBit charge-trapping tech
Samsung and Toshiba join hands to develop DDR NAND flash memory with 400Mbps interface
Rambus granted its 1,000th Patent
Toshiba starts builiding Fab 5 facility for making NAND flash chips
PCT to sell Microchip's serial NOR-flash products
Semiconductor industry sales forecast for 2010: SIA; 28.4%, Gartner; 27%
Sidense says no Kilopass patent infringement
Microchip sells its NAND flash memory property to Greenliant
Infineon and Elpida settle legal dispute over patent infringement
Robust market demand for semiconductor devices in 2010
Latest semiconductor market stats from SIA and IDC
The market growth to continue for semiconductor industry in remaining quarters of 2010
Video surveillance storage market is forecasted to grow over $5.6 billion by 2013
DRAM market growth momentum continuing
Samsung shipping 20nm NAND flash memory chips
Synopsys DDR memory IP supports Six DDR Standards in single PHY
Capacitor-less below 1V operating ZRAM chips made using bulk silicon can replace DRAM
Flash memory market to grow for another 10 years
Ramtron granted with US patent for it's Ferroelectric RAM
64 GB SDXC card from SanDisk for HD video recording apps
55 nm Embedded Flash process tech from ST Micro for making automotive MCU chips
Samsung begins volume production of 4Gb DDR3 DRAM chips at 40nm node
Fujitsu and University of Toronto developed reliable read-method for MRAM
2 Gb DDR3 DRAM chip jointly developed by Micron and Nanya
Intel and Micron's 25-nanometer NAND flash tech for consumer electronic gadgets
LSI and Seagate collaborate on solid-state storage tech
OTP memory IP from Sidense drives Audium's power amplifier chip
Samsung and Rambus settle their patent related disputes and claims
Merry times for Hynix Semi with its 4th quarter 2009 revenues rose
Future Electronics to sell and stock Ramtron chips
Year 2009 is not that bad for memory chip makers and 2010 going to be even better
40nm 2-Gigabit DDR3 SDRAM volume production shipment from Elpida
65nm XS Version 1-Gigabit DDR3 SDRAM from Elpida
Elpida receives "2009 Global Warming Prevention Activity Award"
Hynix Semiconductor's 2Gb DDR3 DRAM devices Validated by Intel
DRAM test lab opened in Munich Germany
Over a billion SoCs integrate flash memory interface IP components from Arasan Chip Systems
Agilent and Nexus deliver DDR3 memory bus debug solutions
Semiconductor industry's fast recovery in 3rd Q 09 is due to processor and DRAM demand
Indilinx, Cavium and Narinet collaborated to bring SSD into networking storage systems
Intel and Numonyx achieve stacking of PCM arrays to increase memory capacity
MagnaChip offers 0.11um, 30V process technology with small SRAM cell size
Logic Devices is sampling its first DDR2 DRAM modules
Elpida memory completes the development of the 40nm 2-gigabit DDR3SDRAM
Samsung producing 512-Megabit nonvolatile memory PRAM
Semiconductor industry is cautiously optimistic on next phase of growth
IBM's on-chip DRAM prototype technology achievements
Moser Baer is quickly gaining share in USB flash memory market
DDR3 based threaded module prototype for multicore computing
Ramtron settles product defect claim of its memory product
SPMT's abridged technology specifications for mobile devices
LSI retained its top position in Host Bus RAID Controller market with further growth
Ramtron secures $6 million credit from Silicon Valley Bank
8.5 GB DVD media launched by the Moser Baer
Toshiba is shipping 43nm NAND flash in volumes to laptop OEMs
IDT powered by Tundra's expertise is allying with Micron to develop PCIe SSDs
FRAM chips from Ramtron are selected for high-rel SSD
Rambus unfolds DRAM innovations beyond DDR3
New industry consortium to promote serial interfaced DRAMs
Transistor-less semiconductor memory denser and faster than NAND
Joint development of NAND flash memory controllers by Hynix, Numonyx and Phison
Toshiba to make single chip flash memory of 32 Gb capacity using 32nm process
Rambus buys Inapac patents related to System-in-Package solutions
Samsung producing NAND flash chips in 40-nm process technology
Hynix agree to compensate Rambus for using its technology in SDR and DDR SDRAM
Q4 2008 revenues freeze semiconductor industry to a dope less silicon
Ramtron to make its FRAM chips using IBM foundry
Toshiba achieves 3-bit-per-cell 32Gb record in NAND Flash capacity
Taiwan's DRAM vendor Powerchip semiconductor posts 1.603 billion NT$ revenue for Jan-09
SST revenues for 4Q08 were $58.4 million compared with $92.4 million in 3Q
Rexchip earns TOSHMS certification
Detailed study of possibility of a $20 Laptop computer
John Kispert is the new CEO and Director of Spansion
Innovation in DRAM focuses on package and speed
California Federal District Court halts Rambus patent infringement case Against Micron
New security technology for 2.5-inch encrypted hard disk drives
Chang-Soo Choi is now the President and CEO of Samsung Electronics America
Intel's another legend Craig Barrett to Retire in May
Technology to transfer data from DRAM chips to processor @ 1 terabyte per second
Vanguard International Semiconductor reports 2008 revenue of NT$16,120 million
Qimonda is shipping Rambus XDR DRAM in volumes to PlayStation3 gaming systems
Spansion has planned to sell its business or get merged with other similar company
Micron works with Sun Micro to achieve one million write cycles in NAND flash
Smallest Fin-FET SRAM cell with high-k/Metal gate material
Hitachi GST and Intel to jointly develop Solid State Drives (SSD)
NAND Flash to be mass-produced at 34 nm by Intel and Micron
DRAM vendors Powerchip and Elpida engaged in close talks for a possible merger
Rambus complaints on NVIDIA to International Trade Commission over patent infringement
UMC to make SRAM chips at 28nm node
Samsung steps back from acquiring SanDisk
Z-RAM memory technology breakthrough by Innovative Silicon
Synopsys and Ovonyx team-up in developing simulation models for Phase-change RAM
India's automotive electronic growth opportunities
ISSI opens sales office in Chennai
Hynix and Toshiba to cross license patents and products
Texas Instruments to make 4 MB FRAMs for ATMEL
Renesas and Powerchip agree for a joint venture to design memory devices
Intel ships in volumes it's 1GB, monolithic NOR flash memory chips to mobile phone makers ST Micro gets one NAND license from Samsung Drag and drop solution announced by Altera and Northwest logic for 667-Mbps DDR2 SDRAM interface in Stratix II FPGAs Samsung’s new flash memory development has extended maximum memory capacity of NAND flash memories to 256 MB and a scaling down to 20 nano meters Samsung semiconductor is anticipating to mass produce Phase change Random Access Memory (PRAM) by 2008
New Products
Elpida samples 4Gb DDR3 mobile DRAM
Small sized power ICs for SSDs and hybrid disk-drives
10x10nm² measuring RRAM cell from Imec can replace NAND flash
Low power register for DDR3 memory modules from IDT
Ramtron samples 64Kb 20MHz bus-speed serial SPI FRAM chips
Elpida makes 4-Gigabit DDR3 SDRAM using 25nm process
Dual-interface EEPROM allows wireless access of data via NFC and RFID
Low power embedded flash controller for Smartphones and Tablet Computers
ONFI-3.0 compliant Universal Flash Controller IP core
New evaluation system for AGIGARAM DDR3 Non-Volatile DIMM unveiled
New 128/64/32Mb SRAM chips from Cypress offer 32-bit I/O config with 55-ns access time
256/128/64Kb FRAM chips with SPI interface from Fujitsu
New NAND flash memory wafer and package test solutions from Advantest
Ramtron sampling IBM made 64-Kb serial F-RAM chip
Kilopass expanding its OTP NVM on SMIC's 55 nm logic CMOS process
2-Mb serial EEPROM in SO8N package for storing large size code
Memory chips transit from a zero-power state to a 5+ Gb/s data transfer rate in 5 ns
IDT delivers single-chip enterprise-class flash controller with native PCIe
Freescale licenses memory controllers and serial links from Rambus
Micron sampling its Next-Gen RLDRAM Memory
Ramtron starts shipping IBM made FRAM chips
NAND flash controller IP supports ONFI 3.0
32GB capacity SSD drives in BGA package with SATA AND PATA interface
NAND flash memory compatible high-speed SATA controller from TDK
Embedded multi-time programmable NVM in 40nm
Intel and Micron's new 20nm process produce 8GB flash chip measuring 118mm2
Cadence DDR4 IP offerings: PHY IP; controller IP; memory models; verification IP; tools and methodologies
Toshiba introduces new embedded-NAND flash memory with ECC function in 24nm
Kilopass makes testchip of its 2T antifuse using TSMC 28nm HKMG process
Sidense' OTP NV memory meet the assessment requirements of TSMC's IP9000
Elpida develops 4-Gb DDR2 Mobile DRAM
2Gb DDR4 DRAM from Hynix Semiconductor is twice faster than DDR3
Semiconductor IP startup Uniquify granted patent related to DDR2/DDR3 timing
Flash memory controller for smartphones for 2/3 bit-per-cell NAND flash
JEDEC-compliant memory buffer for DDR3 LRDIMMl
High-rel EEPROM IP blocks designed to withstand temperature up to 170 Deg C
128 KB automotive grade FRAM chips from RAMTRON drop-in replace EEPROMs
Samsung applies TSV tech to 3D stack multiple DDR3 DRAMs
4Gb LPDDR2 DRAM with speed of 1,066 Mbps from Samsung
Toshiba introduces 256 GB solid state disk drives
NV SRAM module from Maxim with embedded RTC and battery in a PowerCap package
Registering clock driver for DDR3 DRAM module apps
2GB DDR3 SDRAM from Elpida made using 30nm process
INNOVENTIONS offers memory tester for DDR3 DRAM
USB 3.0 to NAND flash controller chip from VIA
Isolation Memory Buffer from Inphi for data center servers and cloud computing
USB 3.0 SATA RAID storage devices from Fujitsu
8GB and 16GB NAND Flash memory from Samsung for Smartphone applications
Elpida and Spansion introduces charge trapping 1.8V, 4-Gigabit SLC NAND Flash Memory
New USB 3.0 compliant SATA bridge ICs from Fujitsu
Stamp size 64GB memory drive in BGA package from Sandisk
New 2Gigabit DDR2 mobile RAM from Elpida using 40nm process
New DDR3 memory controller interface for consumer electronics from Rambus
Samsung starts production of 2GB DDR3 DRAM
1.8V Serial Flash memory chip from Microchip for low power electronic devices
32GB memory module from Samsung for server applications
ProMOS successfully produce 1Gb DDR3 DRAM using Elpida's 63nm technology
Intel introduces its SSD products to improve computing experience
SD cards from Toshiba integrates Wi-Fi functionality to digital still cameras
128GB embedded NAND flash memory module from Toshiba for portable electronics
Ramtron serial 1-Mbit F-RAM is automotive qualified
Samsung launches multi chip packaged PRAM devices for mobile phones
2-Gb LP DDR2 DRAM from Micron for ultra-portable computers
Power controller for DDR memory chips from Exar
Intel's new SATA Solid-State Drive (SSD) at $125 for dual drive computers
Integrated serial presence detect EEPROM memory and temperature-monitoring IC
Inphi samples JEDEC-compatible memory buffer to support more memory modules
Embedded DRAM Buffer ICs from NEC Electronics for mobile graphics apps
2-terabyte hard disk drive from Samsung Electronics for desktop systems
30 nanometer, 2Gb green DDR3 DRAM for handheld embedded devices
Integrated NV memory, gamma-correction reference systems with MTP memory
Hynix Semiconductor develops 2Gb DDR2 DRAM for mobile electronic devices
128GB, 32nm Multi-Level Cell NAND-flash-based SSDs from Toshiba
SD 3.0 / eMMC 4.4 Card Controller IP targeting HD multi-media content on handheld devices
2Gb GDDR5 DRAM from Hynix Semiconductor based on 40nm tech
High-density 64GB embedded NAND flash memory device from Toshiba
New SSD memory from Micron targeting notebook and desktop computers
Samsung's new 30nm-class 32Gb MLC NAND flash memory chips
Mid-range and enterprise disk storage systems from Fujitsu
Elpida sampling 32-bit I/O 2-Gigabit DDR2 SDRAM
LSI storage devices inside Cray's supercomputer
Memory device packs 4Gb NAND flash and 2Gb DDR DRAM
256Mbit Serial Flash from Macronix for high storage space apps
34nm MLC NAND flash memory from Micron for enterprise storage with 6x endurance
A 65-nm, 144-Mbit monolithic SRAM from Cypress Semiconductor
PWM controllers from IR for DDR3 memory modules
New 54nm 1Gb DDR3 from Hynix Semiconductor consumes 30% less power
New Magnetoresistive RAM devices from e2v for defense, avionic apps
New serial nvSRAMs from Cypress Semiconductor in the range of 16Kb to 8Mb
New MaxArias RF-enabled wireless memory devices from Ramtron
High speed/density battery-free non-volatile RAM from AGIGA
Elpida developed 2Gb DDR2 Mobile DRAM
SanDisk's Extreme Pro CompactFlash memory cards with Read/Write speed of 90MB/s
Eight-layer through Silicon Via based multi-layer 8-gigabit DRAM from Elpida
16-Kilobit F-RAM memory to meet AEC-Q100 grade 1 automotive standards
Moorestown Platform now supports 4Gb Mobile DDR SDRAM from Hynix
3 bit-per-cell 34nm NAND flash technology jointly by Intel and Micron
SC70 packaged op amp consumes little power of 0.55 microwatt
Intel's 34-Nanometer NAND flash SSDs
Vertical-Mount, SMT DDR2 DIMM socket with low lead coplanarity from Fujitsu
New 256 Kb F-RAM devices with SPI and I2C serial interfaces from Ramtron
New high speed SRAM family from Renesas targeting switches and routers
STMicro packs 512-Kb of storage capacity in EEPROM of size 2 x 3mm
New 8-Megabit F-RAM from Atmel pin-compatible with SRAM
SAMSUNG develops SATA SSD in mini-card size for netbook computers
Micron's new low power DDR3 memory module for portable computers
eMMC4.4 standard based NAND flash memory devices from Micron
Spansion unveiled new 32-128 Mb flash memory with SPI interface
FCRAM ICs withstanding 125 Deg C temperature with DDR SDRAM interface
Hynix developed mobile 1Gb DDR2 DRAM using 54nm process technology
Serial FRAM in 512 Kb and 1 Mb capacities; alternative choice for NOR flash
Microchip specializes its EEPROM by offering in smallest packages
SAMSUNG started shipping 16GB DDR3 DRAM memory modules for servers
Hynix Semiconductor validates MetaRAM based 8GB DDR3 RDIMM
Block-abstracted 8GB and 16GB NAND flash memory for media players
Less space consuming SD Card interface IC for cell phones
New SSD memory controllers support external DRAM interfaces
New EEPROM chips operating at 1.5 Volts for both read and write operations
1.2Gb and 2.5Gb DDR1 integrated memory modules for hi-reliability apps
Flash memory controller for SSD, and CFCs
New NAND flash, DRAM, and software from Micron to kick-start the growth
DSCC approved 32Mb & 64Mb hermetic flash memory modules
First validated 40-nanometer class DRAM
Samsung releases 4Gb DDR3 DRAM chip amid the weak memory market
256-Kilobit serial F-RAM with I2C interface
Serial SRAM with SPI interface for embedded system applications
1-Gigabit XDR DRAM works at speed of 7.2 GHz
Long-wire ZIF probe tips for DDR, GDDR memory validation
4-Megabit F-RAM memory in FBGA package
512GB solid state drive using 43nm Multi-Level Cell NAND
1Gb+ serial NAND flash memory for embedded applications
Hynix is first in achieving 2Gb capacity in single package Mobile DRAMs
7Gbps, 1Gb GDDR5 Graphics DRAM
512-Kilobit Serial F-RAM with high-speed read/write performance
16 Gb monolithic flash memories manufactured using 43nm technology
Atmel's Low Power 1.8V 8-Megabit Serial Flash
NAND flash chip of 32 Gigabit in TSOP package
Hynix 512MB mobile DDR SDRAM works at 185 MHz
Samsung's new 8GB NAND is shipping in samples to mobile-phone makers
ST Micro Automotive grade NOR flash available up to 32 Mbit capacity
10MHz, 32Kbit SPI serial EEPROM from Microchip
Samsung develops 1GB low power DDR memory for cellphones
SST releases new 16MB 1.8V flash memory.
Serial flash memory with 16M capacity and each sector of 4K bytes. Ramtron’s FM3130 is with 64KB of FRAM and real time clock/calender FRAM of 512KB with SPI in 8 pin TDFN package with a max price tag of $7.62 Micron leads the market by releasing 1Gbit DDR3 RAM Blue ray discs of mammoth 50 GB capacity available from TDK
Design Guide
Flash memory chips for your embedded design
The next generation of NonVolatile RAMs (NVRAM)
