Component Engineering
GlobalFoundries to Manufacture RF Chips Designed by Indian DLI-Backed Startup Fermionic Design for Radar, Satellite and 5G Applications
GlobalFoundries will manufacture RF chips designed by Fermionic Design Pvt Ltd. Fermionic Design is a Bangalore-based fabless semiconductor company specializing in RF chipsets for Radar, Satellite Communications, and 5G Phased Array Applications. The company was founded in 2020 by industry
3 min read
NOVOSENSE Launches Integrated Low-Voltage Motor Driver Family Targeting Industrial Automation and Smart Appliances
NOVOSENSE Microelectronics is showcasing a new lineup of motor driver ICs at PCIM Europe 2026, covering two distinct application needs: brushed DC motor control for smart appliances and compact equipment, and multi-channel low-side driving for industrial PLC and factory automati
4 min read
QuickLogic to Join Russell 2000 and Russell 3000 Indexes Effective June 29, 2026
QuickLogic Corporation announced it will be added to the Russell 3000® Index and the Russell 2000Index as part of the 2026 Russell indexes reconstitution. The addition takes effect when the US market opens on June 29, 2026. The annual June reconstitution of the Russell US indexes
2 min read
Intel Launches Rackscale AI Infrastructure and Xeon 6+ Processors at Computex 2026
Intel announced new chip-to-systems-level AI solutions at Computex 2026, addressing inference, agentic workloads, and industry-specific requirements. The announcements include: Rackscale AI Infrastructure: Developed with SambaNova and Foxconn for inference and agent
4 min read
Digi International Launches Digi Connect EZ TS Serial Device Servers for Legacy Infrastructure Modernization
Digi International announced the launch of Digi Connect EZ 4 TS and Digi Connect EZ 8 TS, next-generation serial device servers. The EZ TS family is designed to help organizations modernize legacy serial infrastructure with enhanced security and centralized management without requiring encl
3 min read
Bourns to Showcase Magnetic Components and Circuit Protection Solutions for BMS and OBC at Automotive Engineering Exposition Yokohama 2026
Bourns will exhibit its portfolio of magnetic components, circuit protection solutions, and custom magnetics for automotive applications at the Automotive Engineering Exposition Yokohama 2026. The company will occupy Booth #521 at Pacifico Yokohama from May 27–29, 2026. Exhibition hours are
2 min read
ROHM Launches Configurable PMIC and DrMOS Power Supply Solutions for Automotive SoCs
ROHM has developed a configurable power supply solution combining the PMIC BD968xx-C Series with the DrMOS BD96340MFF-C for automotive SoCs used in ADAS, Driver Monitoring Systems (DMS), and sensing cameras. Increasing performance demands on automotive SoCs, driven by ADAS evolution, enhan
3 min read
Global Electronics Association Expands Multilingual Workforce Training in Six Languages
The Global Electronics Association announced an expansion of its member training program, extending key electronics manufacturing courses across six core languages: English, French, German, Chinese, Spanish, and Malay. The expansion builds on the Association’s existing multilingual lea
2 min read
EZPV-D Series Metallized Polypropylene Film Capacitors Released for Renewable Energy and Industrial Applications
The EZPV-D Series Metallized Polypropylene Plastic Film Capacitors are now available for use in DC-link and DC-filtering applications. The capacitors are designed for solar inverters, wind energy systems, industrial power supplies, and inverter circuits in equipment such as air conditioners
2 min read
Qualcomm Announces Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 Mobile Platforms
Qualcomm Technologies, today announced the Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 Mobile Platforms. Both platforms introduce Snapdragon Smooth Motion UI for improved device interactions. The Snapdragon 6 Gen 5 delivers 20% faster app launches and 18% less screen stutter, while the Snapdragon 4
2 min read
TDK Expands micro POL Power Module Portfolio with New FS3303 for AI Edge Systems
TDK Corporation announced the FS3303, the first device in an expanded micro POL family of ultra-compact, non-isolated DC-DC power modules. The FS3303 measures 2.5 × 2.5 mm with a height of 1.2 mm and delivers 3 A output current. It achieves efficiency up to 95% and supports operation at amb
2 min read
Wind River’s eLxr Pro Selected by Superheat for Industrial Heat Treatment Control Systems
Wind River has been selected by Superheat to power its next-generation industrial controllers using eLxr Pro. The controllers are deployed in oil, gas, energy, shipyard, aerospace, and defense applications. Superheat will use eLxr Pro for its proprietary wireless-remote heat treatment control sys
2 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast
