Latest EE News 23-May-2013

• N.American semicon equipment industry posts April 2013 B-to-B ratio of 1.08
• IEC's latest update to smart grid standard to support non-english labels also
• Cadence further strengthens its IP portfolio by acquiring Evatronix
• Top vendors of semiconductor industry in 1Q 2013 by IC Insights
• ST announces the winners of its Singapore area iNEMO Design Contest 2013
• Processor vendor ranking 2012: Qualcomm and Samsung overtake AMD
• X-CEO of Akros Silicon joins Exar
• Fabless semiconductor companies outpace IDMs for long time
• Sharp to showcase its latest LCD panels at Display Week

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Latest EE News

• Virtual security appliance grew 33% in 2012 and to reach $1.3B in 2017
• Coating for medical implants for preventing them from human body's attack
• Operators offering multiscreen video to grow to 50% by 2014, as per a study
• Researchers find a way to build effective filtering circuit on-chip at low cost
• SiC device market keep on growing +38% y-o-y, as per Yole
• Altera to acquire power semiconductor SoC company Enpirion
• Infonetics: Home n/w device market reached $4.9B in 2H12, a 5% increase over 1H12
• Optical membrane-free microphone wins AMA Innovations Awards 2013
• Atrenta relocates into new R&D facility in Noida, India

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Latest EE Products 23-May-2013

• UWB Doherty reference design using NXP's BLF884P and BLF884PS power amps
• MCU from Fujitsu Semiconductor for AC/DC and DC/DC control of EV cars
• Powerful PCB library tools from IPC to support users of IPC-7351
• high-rel RS-485/422 transceivers supporting data rates up to 20Mbps
• Massive parallel processing for chip-design timing closure in days instead of weeks
• Aldec launches lifecycle management solution for FPGA and ASIC designs
• 700-1400 MHz frequency range LNA with low NF of 0.36dB at 900 MHz
• Toshiba to mass produce 2bit/cell 64Gb NAND flash using 19nm process
• Stanford engineers develop paper-thin non-invasive heart beat sensor

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More EE Products

• New MOSFETs in TO-220CFM package for 90 to 265V AC/DC converter designs
• 200 V, 10-40 Amp Diodes from Power Integrations based on merged-PIN tech
• SiC 1.2 kV, 50 A module equivalent to silicon modules rated at 150 A, available now
• TO-Leadless package from Infineon offers electrical performance and size advantage
• Forte unveil enhanced Cynthesizer SystemC-based HLS tool
• Sensor hub from Freescale to scale 3-axis to a 9-axis inertial measurement
• IC and kit from NXP for MFi accessory development
• SoC from Fujitsu for 360 Degree wraparound view of car surroundings
• App for using formal methods for the verification of low power SOC designs

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