Latest EE News 4-Mar-2014

• India semiconductor fab: LG, Samsung may be the next
• Wolfson selects India based Incube solutions for audio integration
• Analysis on Intel making ICs for Apple
• Tutorials on latest in EDA and IP standards by Accellera
• InvenSense and ST settle patent litigation
• CEVA's DSP powered demos at MWC
• TI names Kim Wong as VP of signal and datapath solutions
• Rudolph sells it new TSV metrology sys to CEA-Leti for 3D IC measurement
• SEMI: Silicon wafer area shipments slightly up but revenues down in 2013

  more news

Latest EE News

• Opinion: US complains on China and want India not to restrict US on Solar PV
• Report on IBM selling its semiconductor biz; who are the potential buyers?
• ESDM component supply chain: Rajamane's battery packs and enclosures
• Transphorm and Fujitsu to merge their GaN power semiconductor biz
• MStar licenses Ravi's DivX HEVC tech for its STB SoCs
• Rudolph received lithography orders worth more than $11 million
• MtronPTI acquires some filter components assets from Trilithic
• Cadence to acquire Forte Design Systems
• Ericsson to acquire Azuki Systems

  more news

Latest EE Products 4-Mar-2014

• Realtek uses Synopsys' software and UMC' fab to make first pass Smart TV SoC
• ST launches ultra low power STM32 MCUs
• Dual gate, ultra-low power CMOS logic from Diodes
• 360-degree magnetic field detector from Murata
• ARM's SBSA spec standard for ARMv8-A based 64-bit server design
• High temperature coin Lithium rechargeable Battery from SII
• Latest version of its static analysis tool from AdaCore
• Hybrid fibre-optic PoE cable can extend up to 2KMs
• Crocus licenses ARM SecurCore SC000 processor

  more new products

More EE Products

• STM32F4 MCUs offer balance of dynamic power consumption and execution performance
• Power supply design tool identifies high-via currents and high resistance paths
• Oclaro starts volume production of 700 mW red laser diode
• High performance 8051 Microcontroller IP core from CAST
• X-ray metrology tool for 3-D semiconductor packaging
• Smaller and tougher 650V and 800V MOSFETs from ST
• STM32 F0 MCUs from ST support crystal-less USB design
• Wideband, high power notch filter reduces cosite interference
• 270 mW compact infrared LED designed for industrial applications

  more new productss

Free Online Embedded Systems Course

Module1- Intro. to Embedded Systems
Module2- Microcontroller and Programming

Sample C Program to interface keypad to ARM Cortex M0 board New

 

EE Herald's video stories

Semicon and software: Lot more to come

More Videos

 

Component Suppy Chain Management Guide

Counterfeit components: Methods to protect against fake parts