Latest EE News 30-Jul-2014

• AMS Dialog merger deal not worked
• GaAs epitaxial substrate revenues declining, as per a study
• ST reports 2.1% sequential q-o-q growth in revenue
• Green electronics metric EPEAT available in India
• My little box dc-ac inverter design challenge by Google and IEEE
• Microsemi acquires Mingoa
• Semiconductor IP market to reach $5.63 Billion as per a market research report
• Smart home market: security, energy saving and media streaming driving the biz
• Q12014 mobile app processor market research findings by Strategy Analytics

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Latest EE News

• $1 trillion communication equipment and software spending over next 5 years
• Sony increases production capacity for stacked CMOS image sensors
• Mentor Graphics appoints new SVP-world trade
• Consumer semiconductor market to see good growth in 2014
• India semiconductor market is forecasted to reach $52.8B by 2020
• IT hardware SME conclave by MAIT in association with DeitY
• FPGA leader Xilinx invests in MCU maker XMOS
• U.S. FDA recognize two UL battery safety standards for medical devices
• STMicroelectronics supports rural innovation in India by partnering with NIF

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Latest EE Products 30-Jul-2014

• Cadence' new RC extraction tool runs faster supporting finFET designs
• KYOCERA mass producing very high Q 01005 size ceramic caps
• Mutual capacitance method capacitive touch sensing IP for high-rel mobile
• e2v introduces Power e600 processor core microprocessor for aerospace
• 920IP, an update to ZigBee IP supporting IPv6
• Zero-drift Op Amps from ST
• Semiconductor manufacturing equipment for 3D NAND fabrication
• Grayhill expands line of 3K Series keypads
• Integrated two stage differential amplifier for DOCSIS 3.0 and 3.1

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More EE Products

• 1 Tera byte SSD using 3D NAND chips
• Isolated 2 Watts DC/DC modules in SMT package
• HD video streaming kit for IOT market
• 3D gesture sensor for cars
• 95% power efficient step-up DC-DC converter IC
• 250 A mains power contactor switch for electric/hybrid vehicle
• LTE stack from NextG-Com on ConnX BSP3 processor core
• MIPI M-PHY 3.0 Gear 3 IP in UMC40LP
• Load Switch from Diodes Incorporated Safeguards USB Ports

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